5SGXEA7K3F40I3L

The 5SGXEA7K3F40I3L is a Stratix V GX field programmable gate array delivered in a 1517-BBGA (40×40) FCBGA package for surface-mount applications. It provides high logic capacity and on-chip memory combined with a large I/O count and industrial temperature grading for designs that require robust, high-density programmable logic.

As part of the Stratix V GX family, this device targets applications that benefit from large programmable logic resources, substantial embedded memory, and extensive I/O. The device is specified with a core supply range of 820 mV to 880 mV and an operating temperature range of −40 °C to 100 °C.

Key Features

• Logic Capacity  622,000 logic elements suitable for complex custom logic implementations and large-scale FPGA designs.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive logic functions.
• I/O Density  696 user I/O pins, enabling broad external connectivity for high-pin-count systems and complex board-level interfaces.
• Package & Mounting  1517-BBGA (1517-FBGA, 40×40) FCBGA package; designed for surface-mount assembly.
• Industrial Temperature Grade  Specified for −40 °C to 100 °C operation, appropriate for industrial-environment deployments.
• Core Supply  Operational voltage range from 820 mV to 880 mV to match system power architectures that support this core rail.
• Family Transceiver Options  Part of the Stratix V GX family; the Stratix V device family documentation includes GX transceiver speed-grade options (family-level values provided in the datasheet).
• Regulatory  RoHS compliant.

Unique Advantages

• High logic density: 622,000 logic elements enable integrated implementation of large FPGA designs without immediate need for external logic expansion.
• Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM reduce external memory dependency for many buffering and data-path functions.
• Extensive I/O capability: 696 I/Os provide flexibility for multi-channel interfaces, parallel buses, and dense board-level connectivity.
• Industrial-rated operation: Specified −40 °C to 100 °C operation supports deployment in industrial environments.
• Compact BGA package: 1517-BBGA (40×40) FCBGA format balances high pin count with a compact footprint for space-constrained designs.
• Standards-aligned compliance: RoHS compliance facilitates use in regions and designs where lead-free assembly is required.

Why Choose 5SGXEA7K3F40I3L?

The 5SGXEA7K3F40I3L combines large programmable logic resources, significant embedded memory, and a high I/O count in an industrial-grade package and temperature range. This combination makes it well-suited to designs that require dense logic integration, substantial on-chip RAM, and reliable operation across extended temperature ranges.

Selecting this Stratix V GX device supports designs that need scalable logic capacity and robust I/O while maintaining a compact BGA footprint and adherence to RoHS requirements. The device is positioned for engineers and procurement teams seeking a high-density FPGA solution backed by Stratix V family documentation and specifications.

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