5SGXEA7K3F40I3N

The 5SGXEA7K3F40I3N is an Intel Stratix® V GX field programmable gate array (FPGA) supplied in a 1517-BBGA FCBGA package. It provides a high density of logic elements and substantial on-chip memory, combined with a large I/O count and industrial temperature capability.

With 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 696 user I/Os, this device is intended for designs that require dense programmable logic, sizeable embedded RAM, and extensive I/O connectivity while operating across an industrial temperature range.

Key Features

• Core & Logic  622,000 logic elements provide high logic capacity for complex digital designs.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffers, FIFOs, and large data structures.
• I/O Capacity  696 I/Os for wide parallel interfaces, comprehensive board-level connectivity, and flexible system integration.
• Power / Voltage  Core voltage supply specified between 820 mV and 880 mV, enabling operation within a defined low-voltage core range.
• Package & Mounting  1517-BBGA (1517-FBGA, 40×40) FCBGA package, surface-mountable for compact high-density PCB layouts.
• Temperature & Grade  Industrial grade with an operating temperature range of –40 °C to 100 °C for deployment in extended-temperature environments.
• Environmental Compliance  RoHS compliant, supporting environmental and regulatory requirements for lead-free manufacturing.

Unique Advantages

• High logic density: 622,000 logic elements enable implementation of complex, multi-function designs on a single device, reducing the need for external logic.
• Significant on‑chip memory: Approximately 51.2 Mbits of embedded RAM helps minimize external memory requirements for many buffering and data-processing tasks.
• Extensive I/O footprint: 696 I/Os allow broad interfacing options for parallel buses, multi-channel systems, and diverse peripheral connectivity.
• Industrial temperature support: Specified –40 °C to 100 °C operation increases deployment flexibility for temperature-challenging environments.
• Compact, high-density package: 1517-BBGA FCBGA (1517-FBGA, 40×40) supports high pin-count routing in a compact footprint for space-constrained designs.
• Defined low-voltage core: Core supply of 820–880 mV provides predictable power-domain planning for system designers.

Why Choose 5SGXEA7K3F40I3N?

The 5SGXEA7K3F40I3N combines a large logic fabric, substantial embedded memory, and a high I/O count in a compact FCBGA package, making it suitable for demanding digital systems that require integration and density. Its industrial temperature grade and RoHS compliance add practical robustness for extended-environment deployments.

This device is well suited to engineering teams seeking a high-capacity Stratix® V GX FPGA with clearly defined electrical and package characteristics, enabling scalable designs with predictable power and thermal considerations.

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