5SGXEA7K3F40I4

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 51200000 622000 1517-BBGA, FCBGA

Quantity 1,861 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7K3F40I4 – Stratix® V GX FPGA, 622,000 Logic Elements

The 5SGXEA7K3F40I4 is a Stratix V GX field programmable gate array (FPGA) in a 1517-BBGA (FCBGA) package targeted at industrial-grade applications. This device offers high logic capacity, abundant embedded memory, and a large number of user I/Os for complex digital designs requiring significant on-chip resources.

With an operating temperature range of −40 °C to 100 °C and a supply voltage window from 820 mV to 880 mV, the device suits temperature-tolerant, high-density FPGA implementations where integration and system-level resource consolidation are priorities.

Key Features

  • Core Logic  Provides 622,000 logic elements suitable for large-scale logic designs and complex state machines.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffers, FIFOs, and memory-intensive logic functions.
  • I/O Resources  696 user I/O pins to interface with multiple peripherals, memory devices, and board-level buses.
  • Package & Mounting  1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40); surface-mount mounting for standard board assembly processes.
  • Power  Core supply operating range of 820 mV to 880 mV for designs that require a specified low-voltage core rail.
  • Temperature Grade  Industrial grade with an operating range from −40 °C to 100 °C for deployments in demanding environments.
  • Standards Compliance  RoHS compliant.

Typical Applications

  • High-density digital processing  Large logic capacity and substantial on-chip memory make this device suitable for complex digital signal processing pipelines and algorithm acceleration.
  • Telecommunications and networking  High I/O count supports multi-channel interfaces and packet processing functions that require many external connections.
  • Industrial control systems  Industrial temperature rating and robust packaging enable use in industrial automation, machine control, and factory communications.
  • Prototyping and system integration  Significant logic and memory resources allow system architects to consolidate multiple functions into a single FPGA for board- and system-level prototyping.

Unique Advantages

  • Substantial logic capacity: 622,000 logic elements provide the headroom for complex state machines, large pipeline designs, and consolidated system logic.
  • Ample embedded memory: Approximately 51.2 Mbits of on-chip RAM reduce external memory requirements and simplify board-level BOM and routing.
  • Extensive I/O availability: 696 I/Os enable dense peripheral connectivity and support for multiple parallel interfaces without external multiplexing.
  • Industrial-grade operation: Rated for −40 °C to 100 °C to support deployments in harsh or wide-temperature environments.
  • Compact surface-mount package: 1517-BBGA (FCBGA) packaging provides high pin count in a board-friendly surface-mount form factor for compact system designs.
  • RoHS compliant: Conforms to RoHS requirements for environmentally conscious designs.

Why Choose 5SGXEA7K3F40I4?

The 5SGXEA7K3F40I4 targets designs that require a large amount of programmable logic, significant embedded memory, and a high I/O count while maintaining industrial temperature tolerance. Its combination of 622,000 logic elements, approximately 51.2 Mbits of on-chip RAM, and 696 I/Os enables consolidation of complex subsystems into a single FPGA footprint.

Engineers selecting this device gain a robust platform for high-density digital implementations and industrial applications where on-chip resources and operating temperature range matter. The FCBGA package and surface-mount mounting support standard board assembly workflows while RoHS compliance addresses environmental requirements.

Request a quote or submit a procurement inquiry to receive pricing and lead-time information for the 5SGXEA7K3F40I4.

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