5SGXEA7K3F40I4
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 51200000 622000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,861 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXEA7K3F40I4 – Stratix® V GX FPGA, 622,000 Logic Elements
The 5SGXEA7K3F40I4 is a Stratix V GX field programmable gate array (FPGA) in a 1517-BBGA (FCBGA) package targeted at industrial-grade applications. This device offers high logic capacity, abundant embedded memory, and a large number of user I/Os for complex digital designs requiring significant on-chip resources.
With an operating temperature range of −40 °C to 100 °C and a supply voltage window from 820 mV to 880 mV, the device suits temperature-tolerant, high-density FPGA implementations where integration and system-level resource consolidation are priorities.
Key Features
- Core Logic Provides 622,000 logic elements suitable for large-scale logic designs and complex state machines.
- Embedded Memory Approximately 51.2 Mbits of on-chip RAM to support buffers, FIFOs, and memory-intensive logic functions.
- I/O Resources 696 user I/O pins to interface with multiple peripherals, memory devices, and board-level buses.
- Package & Mounting 1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40); surface-mount mounting for standard board assembly processes.
- Power Core supply operating range of 820 mV to 880 mV for designs that require a specified low-voltage core rail.
- Temperature Grade Industrial grade with an operating range from −40 °C to 100 °C for deployments in demanding environments.
- Standards Compliance RoHS compliant.
Typical Applications
- High-density digital processing Large logic capacity and substantial on-chip memory make this device suitable for complex digital signal processing pipelines and algorithm acceleration.
- Telecommunications and networking High I/O count supports multi-channel interfaces and packet processing functions that require many external connections.
- Industrial control systems Industrial temperature rating and robust packaging enable use in industrial automation, machine control, and factory communications.
- Prototyping and system integration Significant logic and memory resources allow system architects to consolidate multiple functions into a single FPGA for board- and system-level prototyping.
Unique Advantages
- Substantial logic capacity: 622,000 logic elements provide the headroom for complex state machines, large pipeline designs, and consolidated system logic.
- Ample embedded memory: Approximately 51.2 Mbits of on-chip RAM reduce external memory requirements and simplify board-level BOM and routing.
- Extensive I/O availability: 696 I/Os enable dense peripheral connectivity and support for multiple parallel interfaces without external multiplexing.
- Industrial-grade operation: Rated for −40 °C to 100 °C to support deployments in harsh or wide-temperature environments.
- Compact surface-mount package: 1517-BBGA (FCBGA) packaging provides high pin count in a board-friendly surface-mount form factor for compact system designs.
- RoHS compliant: Conforms to RoHS requirements for environmentally conscious designs.
Why Choose 5SGXEA7K3F40I4?
The 5SGXEA7K3F40I4 targets designs that require a large amount of programmable logic, significant embedded memory, and a high I/O count while maintaining industrial temperature tolerance. Its combination of 622,000 logic elements, approximately 51.2 Mbits of on-chip RAM, and 696 I/Os enables consolidation of complex subsystems into a single FPGA footprint.
Engineers selecting this device gain a robust platform for high-density digital implementations and industrial applications where on-chip resources and operating temperature range matter. The FCBGA package and surface-mount mounting support standard board assembly workflows while RoHS compliance addresses environmental requirements.
Request a quote or submit a procurement inquiry to receive pricing and lead-time information for the 5SGXEA7K3F40I4.

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