5SGXEA7K3F40I3WN

The 5SGXEA7K3F40I3WN is a Stratix® V GX family Field Programmable Gate Array (FPGA) offered in an industrial temperature grade. It delivers very high logic density, large on‑chip memory, and an extensive I/O count for designs that require substantial programmable logic and connectivity in a surface‑mount FCBGA package.

Key architectural highlights include 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 696 I/Os—making this device suitable for demanding industrial applications where density, I/O capacity, and extended temperature range are required.

Key Features

• Core Logic 622,000 logic elements to implement complex state machines, datapaths, and custom accelerators.
• Embedded Memory Approximately 51.2 Mbits of on‑chip RAM for buffering, lookup tables, and high‑throughput data storage.
• I/O Capacity 696 I/Os to support large numbers of peripheral interfaces, wide parallel buses, or multi‑lane front‑end connections.
• Package & Mounting 1517‑BBGA FCBGA package (supplier device package: 1517‑FBGA (40×40)), designed for surface‑mount PCB assembly.
• Power Core supply voltage range from 820 mV to 880 mV for precise core power delivery.
• Temperature & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in extended‑temperature environments.
• Regulatory RoHS compliant.

Typical Applications

• Industrial Control & Automation Industrial temperature rating (−40 °C to 100 °C) and high I/O count suit complex control systems, real‑time processing, and sensor aggregation.
• High‑Density Logic Implementations Large logic capacity (622,000 logic elements) and substantial embedded memory enable sophisticated custom logic, DSP pipelines, and protocol handling.
• High‑I/O Systems 696 I/Os accommodate wide parallel interfaces, multi‑channel I/O hubs, and dense peripheral connectivity on a single device.

Unique Advantages

• High Logic Density: 622,000 logic elements provide the capacity to consolidate multiple functions and reduce BOM complexity.
• Generous On‑Chip Memory: Approximately 51.2 Mbits of embedded RAM support large buffering and state storage without needing external memory.
• Extensive I/O Scale: 696 I/Os let you design highly connected systems while minimizing external interface components.
• Industrial Temperature Rating: Rated from −40 °C to 100 °C for reliable operation in harsh or factory environments.
• Surface‑Mount FCBGA Package: 1517‑BBGA package in a 40×40 supplier footprint supports compact PCB layouts and production assembly flows.
• Regulatory Compliance: RoHS compliance simplifies environmental and manufacturing considerations.

Why Choose 5SGXEA7K3F40I3WN?

The 5SGXEA7K3F40I3WN positions itself as a high‑capacity, industrial‑grade Stratix V GX FPGA for designs that require large programmable logic resources, substantial embedded memory, and broad I/O capability in a single surface‑mount package. Its combination of 622,000 logic elements, approximately 51.2 Mbits of RAM, and 696 I/Os helps consolidate system functions and reduce external component counts.

This device is suited for engineering teams building complex, high‑density systems for industrial environments where extended temperature range, tight integration, and RoHS compliance are priorities.

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