5SGXEA7K3F40I3W

The 5SGXEA7K3F40I3W is an Intel Stratix® V GX field programmable gate array (FPGA) offered in an industrial temperature grade. It delivers a large logic fabric combined with substantial on-chip memory and a high I/O count in a compact 1517-BBGA (FCBGA) package.

Designed for complex, high-density programmable-logic designs, this device provides 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and up to 696 I/Os while operating from a core supply of 820 mV to 880 mV and across a −40°C to 100°C temperature range.

Key Features

• Core Capacity — 622,000 logic elements to support large-scale logic integration and complex designs.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for buffering, state storage, and memory-intensive logic functions.
• I/O and Package — Up to 696 general-purpose I/Os provided in a 1517-BBGA (1517-FBGA, 40×40) FCBGA package for high pin-density applications.
• Power — Core supply voltage range of 820 mV to 880 mV for defined core-power operation.
• Thermal and Grade — Industrial temperature grade with operating range from −40°C to 100°C to address demanding environmental conditions.
• Mounting and Compliance — Surface-mount device with RoHS compliance for standard manufacturing and environmental requirements.

Typical Applications

• High-density digital systems — Large logic capacity and ample embedded memory make this device suitable for complex digital processing and algorithm implementation.
• Multi-I/O interface platforms — Up to 696 I/Os support designs that require extensive peripheral or bus connectivity.
• Memory-intensive logic — Approximately 51.2 Mbits of embedded RAM supports buffering, FIFOs, and other on-chip data storage needs.
• Industrial electronics — Industrial temperature rating and robust packaging address applications that operate across wide temperature ranges.

Unique Advantages

• Highly integrated logic and memory: 622,000 logic elements combined with ~51.2 Mbits of embedded RAM reduce the need for external components and simplify board design.
• High I/O density: 696 I/Os in a 1517-BBGA FCBGA footprint enable complex connectivity in a compact form factor.
• Industrial robustness: Rated to operate from −40°C to 100°C, supporting deployments in demanding thermal environments.
• Defined core power envelope: Core supply specified at 820 mV–880 mV to guide power delivery and board-level design.
• Surface-mount, RoHS-compliant package: Facilitates modern assembly processes while meeting environmental compliance requirements.

Why Choose 5SGXEA7K3F40I3W?

The 5SGXEA7K3F40I3W positions itself as a high-density Stratix V GX FPGA option for designs that require extensive programmable logic, significant on-chip memory, and a large number of I/Os in a compact FCBGA package. Its industrial temperature rating and specified core voltage range make it suitable for robust, long-life designs where environmental range and power definition matter.

This device is well suited for engineering teams building complex, I/O-rich systems that benefit from integrating logic and memory on-chip to reduce external component count and simplify board routing. The combination of capacity, packaging, and industrial-grade operating range supports scalable designs and predictable system-level integration.

If you would like pricing, availability, or to request a quote for 5SGXEA7K3F40I3W, submit an inquiry or request a quote through your usual procurement channel. A sales or technical contact will respond with ordering and support information.