5SGXEA7K3F40I4G

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 51200000 622000 1517-BBGA, FCBGA

Quantity 1,856 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7K3F40I4G – Stratix V GX FPGA, 622,000 Logic Elements, 696 I/O, 1517-BBGA

The 5SGXEA7K3F40I4G is a Stratix® V GX Field Programmable Gate Array (FPGA) in a 1517-BBGA FCBGA package. It delivers high logic capacity and extensive I/O in a surface-mount, industrial-grade device.

Designed for applications that require large programmable logic resources, substantial embedded memory, and robust I/O connectivity, this device provides a combination of performance-oriented silicon and industrial operating range to support demanding embedded and system-level designs.

Key Features

  • Logic Capacity  622,000 logic elements (cells) for implementing large-scale digital designs and complex algorithms.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, lookup tables, and data-path storage.
  • I/O Density  696 I/O pins to enable wide parallel interfaces and flexible board-level connectivity.
  • Core Supply  Voltage supply range of 820 mV to 880 mV suitable for the device core operating window.
  • Package & Mounting  1517-BBGA (FCBGA) package in a 1517-FBGA (40×40) footprint; surface-mount mounting type for compact board integration.
  • Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C to address industrial environmental requirements.
  • Standards Compliance  RoHS compliant, meeting common material and environmental requirements for electronic assemblies.

Typical Applications

  • High-density digital processing  Use the large logic capacity and embedded memory to implement complex signal processing, compute kernels, and custom accelerators.
  • Networking and communications  Leverage the extensive I/O to build wide data paths, packet processing engines, and protocol bridges.
  • Industrial control and automation  Industrial temperature grade and rugged package enable deployment in factory automation, motion control, and process control systems.
  • System-level integration  High I/O count and on-chip memory allow integration of multiple interfaces and data buffering within a single FPGA device.

Unique Advantages

  • High logic density: 622,000 logic elements provide headroom for large designs and multi-function implementations, reducing the need for multiple devices.
  • Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM helps minimize external memory dependencies and simplifies board design.
  • Extensive I/O: 696 I/Os enable broad connectivity options for parallel buses, multi-lane interfaces, and heterogeneous peripherals.
  • Industrial operating range: Rated from –40 °C to 100 °C to support deployment in temperature-challenging environments.
  • Compact, surface-mount package: 1517-BBGA (40×40) FCBGA footprint balances thermal and routing requirements for dense PCB designs.
  • RoHS compliance: Conforms to common environmental material standards for modern assemblies.

Why Choose 5SGXEA7K3F40I4G?

The 5SGXEA7K3F40I4G is positioned for system designs that demand high logic and memory capacity combined with extensive I/O and industrial-grade operation. As a member of the Stratix V GX family, it provides a platform suited to complex digital processing, communications, and industrial control tasks where on-chip resources and environmental robustness matter.

Engineers and procurement teams seeking a scalable, high-capacity FPGA with a compact BGA footprint will find this device well-suited for consolidating functions, simplifying board-level architecture, and supporting long-term deployment in industrial environments.

If you would like pricing, availability, or to request a quote for the 5SGXEA7K3F40I4G, please submit a quote request or sales inquiry with your project requirements and desired quantities.

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