5SGXEA7N1F40C1N

IC FPGA 600 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 51200000 622000 1517-BBGA, FCBGA

Quantity 1,192 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7N1F40C1N – Stratix® V GX FPGA, 622,000 logic elements

The 5SGXEA7N1F40C1N is a Stratix V GX field-programmable gate array (FPGA) from Intel, optimized for high-density logic and large embedded memory requirements. This commercial-grade device provides extensive I/O and on-chip RAM to support complex digital processing, protocol bridging, and hardware-accelerated algorithms.

Its combination of 622,000 logic elements, approximately 51.2 Mbits of embedded RAM, and 600 user I/Os targets designs that require integration of large logic fabrics and substantial local memory while operating within a 0 °C to 85 °C commercial temperature range.

Key Features

  • Core Logic Capacity  622,000 logic elements for high-density FPGA implementations and complex logic designs.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support large buffering, lookup tables, and on-chip data storage.
  • High I/O Count  600 available I/Os to accommodate wide peripheral interfaces, parallel buses, and multi-channel connectivity.
  • Power and Core Voltage  Specified core supply range from 870 mV to 930 mV for the device core power domain.
  • Package and Mounting  1517-BBGA FCBGA package (supplier device package 1517-FBGA, 40×40) with surface-mount mounting for compact board integration.
  • Commercial Grade Temperature  Operating temperature range of 0 °C to 85 °C suitable for standard commercial applications.
  • RoHS Compliant  Environmentally compliant with RoHS requirements.

Typical Applications

  • High-density digital processing  Use the large logic capacity and on-chip RAM for data-path acceleration, algorithm implementation, and real-time processing tasks.
  • Protocol bridging and gateway  Large I/O count enables interface consolidation and protocol conversion between multiple parallel and serial domains.
  • Custom compute and hardware acceleration  Leverage the abundant logic and memory resources to implement hardware accelerators for compute-intensive workloads.

Unique Advantages

  • Highly integrated logic and memory: 622,000 logic elements combined with ~51.2 Mbits RAM reduces the need for external memory and simplifies board design.
  • Extensive I/O resources: 600 I/Os provide flexibility for complex interfacing, minimizing the need for external multiplexing or additional bridges.
  • Compact, production-ready package: 1517-BBGA (40×40) FCBGA surface-mount package supports dense PCB layouts for space-constrained applications.
  • Low-voltage core: Specified 870 mV–930 mV supply supports designs optimized for the device’s core power domain.
  • Commercial temperature suitability: Rated for 0 °C to 85 °C operation to match standard commercial deployments.

Why Choose 5SGXEA7N1F40C1N?

The 5SGXEA7N1F40C1N positions itself as a high-capacity Stratix V GX FPGA for development teams that require a dense logic fabric, substantial on-chip memory, and large I/O counts in a compact FCBGA package. Its commercial temperature rating and RoHS compliance make it suitable for mainstream electronic products and prototyping where high integration is required.

Designed within the Stratix V family from Intel, this device is well suited for engineers building complex data-paths, protocol converters, and hardware-accelerated functions that benefit from on-chip memory and broad interfacing capability. The device’s specification set supports scalable designs where board-level integration and on-chip resources reduce BOM complexity and simplify layout.

Request a quote or submit an inquiry for pricing and availability to evaluate the 5SGXEA7N1F40C1N for your design requirements.

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