5SGXEA7N1F40C2L

The 5SGXEA7N1F40C2L is a Stratix V GX field programmable gate array packaged in a 1517-BBGA (FCBGA) surface-mount form. It delivers high on-chip logic capacity with substantial embedded memory and a large I/O count for dense, system-level integration in commercial-temperature applications.

Built on the Stratix V GX family, this device is intended for designs that require extensive programmable logic (622,000 logic elements), approximately 51.2 Mbits of embedded RAM, and up to 600 I/Os, while operating from a core supply in the 820 mV–880 mV range and within a 0 °C to 85 °C commercial temperature window.

Key Features

• Core Logic Capacity  622,000 logic elements (cells) provide the programmable fabric needed for complex custom logic and large FPGA designs.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, large state machines, and data-path storage.
• I/O Density  Up to 600 user I/Os for broad interfacing to peripherals, memory, and high-speed links.
• Package & Mounting  1517-BBGA, FCBGA package (supplier package: 1517-FBGA, 40×40) in a surface-mount format for compact board-level integration.
• Power Supply  Core voltage range of 820 mV to 880 mV to match system power domains and power-management strategies.
• Operating Grade  Commercial grade device rated for 0 °C to 85 °C operation.
• Standards Compliance  RoHS compliant.
• Stratix V GX Family Capability  As a GX-class Stratix V device, the family documentation lists high-speed transceiver support and detailed I/O timing and programmable I/O element delay controls referenced for design integration.

Typical Applications

• High‑speed communications  Use the Stratix V GX device family’s transceiver-capable architecture combined with dense logic and memory to implement packet processing, protocol bridging, and other network functions.
• Data-path acceleration  Large logic capacity and substantial on-chip RAM enable custom hardware acceleration for compute-intensive algorithms and streaming data processing.
• System integration and prototyping  High I/O count and compact FCBGA packaging support board-level consolidation of multiple interfaces for system validation and hardware prototyping.

Unique Advantages

• High integration of logic and memory: 622,000 logic elements and approximately 51.2 Mbits of embedded RAM reduce external component count and simplify board design.
• Large I/O complement: 600 I/Os let you connect a wide range of external devices and interfaces without significant multiplexing or external glue logic.
• Compact, board-ready package: 1517-BBGA (1517-FBGA 40×40) surface-mount package streamlines placement in space-constrained designs.
• Commercial temperature rating: Rated 0 °C to 85 °C for mainstream electronic applications where commercial-grade operation is required.
• Regulatory friendliness: RoHS compliance supports environmentally conscious manufacturing and supply-chain requirements.

Why Choose 5SGXEA7N1F40C2L?

The 5SGXEA7N1F40C2L provides a combination of very high logic density, substantial embedded memory, and a large number of I/Os in a single Stratix V GX device targeted at commercial-temperature designs. Its package and power specifications make it suitable for integrated system designs that demand consolidated logic, on-chip storage, and extensive external connectivity.

This device is well suited to engineering teams building high-performance communications hardware, custom data-path accelerators, or platform prototypes that require scalable logic resources backed by Stratix V family electrical and timing documentation.

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