5SGXEA7N1F40C2LN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 51200000 622000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,717 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXEA7N1F40C2LN – Stratix® V GX FPGA, 622,000 Logic Elements, ~51.2 Mbits RAM, 600 I/Os, 1517-BBGA
The 5SGXEA7N1F40C2LN is a Stratix® V GX field programmable gate array (FPGA) in a 1517-BBGA (FCBGA) package. It provides a large on-chip logic capacity and embedded memory footprint together with a high I/O count for complex programmable logic designs.
This device is specified for commercial-grade operation with a core supply range of 0.820–0.880 V and an operating temperature range of 0 °C to 85 °C, enabling deployment in temperature-controlled commercial systems.
Key Features
- Core logic capacity 622,000 logic elements available for implementing large-scale digital designs.
- Embedded memory Approximately 51.2 Mbits of on-chip RAM for buffering, state storage, and embedded data processing.
- I/O resources Up to 600 user I/Os to support broad interfacing requirements.
- Package and mounting 1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40), surface-mount mounting type for compact board-level integration.
- Power supply Core voltage supply specified from 820 mV to 880 mV.
- Operating grade and temperature Commercial grade device; specified operating temperature range 0 °C to 85 °C.
- Compliance RoHS compliant.
Typical Applications
- Large-scale programmable logic designs Leverages 622,000 logic elements and approximately 51.2 Mbits of embedded memory for complex finite-state machines, datapaths, and custom hardware accelerators.
- High-density I/O systems Up to 600 I/Os support dense peripheral interfacing and multi-channel connectivity on a single device.
- Board-level integration Surface-mount 1517-BBGA package (40×40) enables compact placement in commercial electronic systems.
Unique Advantages
- Substantial logic resources: 622,000 logic elements provide the capacity to implement large, complex designs without immediate device migration.
- Significant embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage tasks.
- High I/O density: 600 I/Os enable broad interfacing options for multi-signal and multi-protocol designs.
- Compact FCBGA packaging: 1517-BBGA (40×40) supports high-density board layouts while maintaining surface-mount assembly.
- Commercial temperature qualification: Rated for 0 °C to 85 °C operation to match commercial system environments.
- Regulatory alignment: RoHS compliance supports use in designs targeting regulated markets.
Why Choose 5SGXEA7N1F40C2LN?
The 5SGXEA7N1F40C2LN combines a large logic element count, substantial on-chip memory, and a high I/O complement in a compact 1517-BBGA package, making it a practical choice for complex, high-density programmable logic implementations in commercial electronic products. Its specified core voltage range and commercial operating temperature band provide clear electrical and environmental parameters for system design and validation.
This device suits design teams and program managers who require verifiable, specification-driven FPGA capacity and integration—delivering on-chip resources and package options that support consolidation of logic, memory, and I/O in a single programmable device.
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