5SGXEA7N1F40C2LG

IC FPGA 600 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 51200000 622000 1517-BBGA, FCBGA

Quantity 583 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7N1F40C2LG – Stratix V GX Field Programmable Gate Array (FPGA)

The 5SGXEA7N1F40C2LG is a Stratix® V GX FPGA IC from Intel, offered in a 1517-BBGA (FCBGA) package. It provides a high-density programmable logic fabric with dedicated embedded memory and extensive I/O capability for complex digital designs.

This commercial-grade device (0 °C to 85 °C) combines a large logic element count, substantial on-chip RAM, and a high I/O pin count in a surface-mount FCBGA package, making it suitable for demanding FPGA implementations that require density and integration.

Key Features

  • Logic Capacity — 622,000 logic elements (cells) to implement complex custom logic and large-scale RTL designs.
  • Embedded Memory — Approximately 51.2 Mbits of on-chip RAM to support buffering, lookup tables, and data-path storage without external memory dependence.
  • I/O Resources — 600 I/O pins to interface with wide external buses, peripherals, and multi-channel connectivity.
  • Voltage Supply — Core voltage specified from 820 mV to 880 mV for the device power domain.
  • Package & Mounting — 1517-BBGA (FCBGA) / supplier device package 1517-FBGA (40×40), surface-mount for compact board integration.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial applications.
  • RoHS Compliant — Conforms to RoHS environmental requirements.

Unique Advantages

  • High logic density — 622k logic elements provide the capacity to implement large, complex designs on a single device, reducing multi-device system complexity.
  • Significant embedded memory — Approximately 51.2 Mbits of on-chip RAM enables large on-chip buffering and data processing without immediate reliance on external memory components.
  • Extensive I/O connectivity — 600 I/Os allow flexible interfacing to a broad range of external devices and buses, simplifying board-level integration.
  • Compact FCBGA package — The 1517-BBGA package offers a dense footprint for space-constrained designs while supporting surface-mount assembly processes.
  • Commercial operating range — Designed and specified for 0 °C to 85 °C environments, aligning with standard commercial product requirements.
  • Regulatory alignment — RoHS compliance supports environmental and regulatory requirements for modern electronics manufacturing.

Why Choose 5SGXEA7N1F40C2LG?

The 5SGXEA7N1F40C2LG combines a large logic element count, substantial embedded RAM, and a high I/O pin count in a compact FCBGA package, delivering a highly integrated FPGA option for complex digital designs. Its commercial temperature rating and RoHS compliance make it suitable for mainstream commercial applications where density and on-chip memory are priorities.

As a Stratix V GX device from Intel, this FPGA is documented within Intel/Altera device literature, providing the technical detail needed to evaluate integration and system-level design trade-offs.

Please request a quote or submit a procurement inquiry to obtain pricing, availability, and ordering information for the 5SGXEA7N1F40C2LG.

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