5SGXEA7N1F40C2

The 5SGXEA7N1F40C2 is a Stratix V GX field programmable gate array (FPGA) in a 1517‑FBGA (40×40) surface‑mount package. It provides very high logic density, a large embedded memory resource, and a 600‑pin I/O count, making it suitable for designs that require extensive on‑chip logic, memory buffering, and high I/O connectivity.

Built to the Stratix V GX device family specifications, this commercial‑grade FPGA supports system designs that demand integration of dense logic, significant on‑chip RAM, and configurable I/O in a compact FCBGA package.

Key Features

• High logic capacity — 622,000 logic elements (cells) for implementing large, complex digital designs.
• Embedded memory — approximately 51.2 Mbits of on‑chip RAM to support buffering, packet processing, and large data structures without external memory.
• Extensive I/O — 600 user I/O pins to interface with high‑pin‑count peripherals, mezzanine connectors, and multi‑lane systems.
• Stratix V GX transceiver capability — as part of the Stratix V GX family, the device supports series transceiver speed grades (series documentation lists GX channels up to 14.1 Gbps), enabling high‑speed serial links where applicable.
• Power and core supply — low‑voltage core operation with a specified supply range of 870 mV to 930 mV for the device core.
• Commercial temperature grade — rated for operation from 0 °C to 85 °C for commercial applications.
• FCBGA packaging — 1517‑BBGA package (supplier package: 1517‑FBGA, 40×40) in a surface‑mount form factor for board‑level integration.
• RoHS compliant — conforms to RoHS requirements for reduced hazardous substances.

Typical Applications

• High‑density digital processing — implement complex state machines, DSP pipelines, and parallel compute structures using the large logic fabric and on‑chip RAM.
• High‑I/O systems — connect to multiple interfaces, front‑end modules, or dense connectors requiring up to 600 I/O pins.
• On‑chip buffering and memory‑intensive functions — leverage approximately 51.2 Mbits of embedded memory for packet buffering, FIFOs, and large lookup tables.
• Compact board designs — FCBGA surface‑mount package supports high‑density PCB layouts where package area and pin count are critical.

Unique Advantages

• Significant logic scale: 622,000 logic elements provide headroom to implement large SoC‑style designs or multiple subsystems in a single device.
• Large embedded memory: approximately 51.2 Mbits of on‑chip RAM reduces reliance on external memory, simplifying BOM and improving latency for memory‑heavy tasks.
• High pin count: 600 I/Os enable direct connectivity to multiple high‑density interfaces and parallel buses without external expanders.
• Low core voltage operation: a defined 870–930 mV core supply range supports modern low‑voltage system designs and consistent power provisioning.
• Commercial temperature rating: specified 0 °C to 85 °C operation for mainstream commercial applications and environments.
• RoHS compliance: helps meet regulatory and environmental objectives for product assemblies.

Why Choose 5SGXEA7N1F40C2?

This Stratix V GX FPGA combines high logic density, substantial embedded memory, and a large I/O complement in a compact FCBGA package, positioning it for demanding commercial designs that require integration of multiple high‑performance functions on a single device. Its specified core voltage range and commercial temperature grade provide predictable electrical and environmental characteristics for production systems.

Choose the 5SGXEA7N1F40C2 when your design needs significant on‑chip resources, high I/O counts, and the Stratix V GX family feature set available at the device and series level.

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