5SGXEA7K3F40I3G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 51200000 622000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 132 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXEA7K3F40I3G – Stratix® V GX FPGA, 696 I/O, 1517-BBGA
The 5SGXEA7K3F40I3G is a Stratix® V GX field-programmable gate array (FPGA) supplied in a 1517-ball BGA (FCBGA) package for surface-mount applications. This industrial-grade device delivers a high logic capacity and large on-chip memory, making it suitable for complex, high-density digital designs that require extensive programmable logic and I/O resources.
Key architectural highlights include 622,000 logic elements and approximately 51.2 Mbits of embedded memory, complemented by up to 696 user I/O pins and a low-voltage core supply range of 820 mV to 880 mV. The device is specified for an operating temperature range of −40 °C to 100 °C and is RoHS compliant.
Key Features
- Logic Capacity 622,000 logic elements provide substantial programmable fabric for large finite-state machines, datapaths, and control logic.
- Embedded Memory Approximately 51.2 Mbits of on-chip RAM to support buffering, large LUT-based functions, and memory-intensive algorithms.
- I/O Resources Up to 696 I/O pins enable dense external interfacing and flexible system-level connectivity.
- Power and Core Supply Core voltage supply range of 820 mV to 880 mV to match system power-architecture requirements.
- Package & Mounting 1517-BBGA (FCBGA) surface-mount package, supplier device package listed as 1517-FBGA (40×40), for compact board-level integration.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C for reliable performance in industrial environments.
- Regulatory Compliance RoHS compliant to support environmentally conscious product designs.
Typical Applications
- High-density digital systems: Designs that require large programmable logic capacity and substantial on-chip memory for complex control and processing functions.
- Custom I/O platforms: Systems that need broad and flexible I/O counts for interfacing multiple peripherals, sensors, or external memory devices.
- Industrial equipment: Embedded controllers and automation systems that benefit from an industrial operating temperature range and robust packaging.
Unique Advantages
- High logic integration: 622,000 logic elements reduce the need for multiple devices, simplifying board-level design and lowering BOM complexity.
- Large on-chip memory: Approximately 51.2 Mbits of embedded RAM supports data buffering and memory-hungry algorithms without immediate dependence on external memory.
- Extensive I/O capability: 696 I/Os provide flexibility for dense connector routing and a wide variety of peripheral interfaces.
- Industrial reliability: Rated for −40 °C to 100 °C operation to withstand demanding environmental conditions common in industrial applications.
- Compact BGA package: 1517-ball FCBGA enables high-density mounting and thermal performance suitable for space-constrained systems.
- Standards-conscious design: RoHS compliance supports environmentally responsible product development and supply-chain requirements.
Why Choose 5SGXEA7K3F40I3G?
The 5SGXEA7K3F40I3G positions itself as a high-capacity Stratix V GX FPGA for designs that demand large programmable logic, substantial embedded memory, and extensive I/O in an industrial-grade package. Its combination of 622,000 logic elements, approximately 51.2 Mbits of on-chip RAM, and 696 user I/Os makes it well suited for complex digital systems, custom interface platforms, and industrial control applications.
Engineers and procurement teams seeking a robust, high-density FPGA solution will find this device offers a balance of integration, thermal range, and compliance attributes that support scalable, long-lived designs.
Request a quote or submit an inquiry to evaluate the 5SGXEA7K3F40I3G for your next design and obtain detailed ordering and availability information.

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