5SGXEA7K3F40I3G

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 51200000 622000 1517-BBGA, FCBGA

Quantity 132 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7K3F40I3G – Stratix® V GX FPGA, 696 I/O, 1517-BBGA

The 5SGXEA7K3F40I3G is a Stratix® V GX field-programmable gate array (FPGA) supplied in a 1517-ball BGA (FCBGA) package for surface-mount applications. This industrial-grade device delivers a high logic capacity and large on-chip memory, making it suitable for complex, high-density digital designs that require extensive programmable logic and I/O resources.

Key architectural highlights include 622,000 logic elements and approximately 51.2 Mbits of embedded memory, complemented by up to 696 user I/O pins and a low-voltage core supply range of 820 mV to 880 mV. The device is specified for an operating temperature range of −40 °C to 100 °C and is RoHS compliant.

Key Features

  • Logic Capacity  622,000 logic elements provide substantial programmable fabric for large finite-state machines, datapaths, and control logic.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, large LUT-based functions, and memory-intensive algorithms.
  • I/O Resources  Up to 696 I/O pins enable dense external interfacing and flexible system-level connectivity.
  • Power and Core Supply  Core voltage supply range of 820 mV to 880 mV to match system power-architecture requirements.
  • Package & Mounting  1517-BBGA (FCBGA) surface-mount package, supplier device package listed as 1517-FBGA (40×40), for compact board-level integration.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for reliable performance in industrial environments.
  • Regulatory Compliance  RoHS compliant to support environmentally conscious product designs.

Typical Applications

  • High-density digital systems: Designs that require large programmable logic capacity and substantial on-chip memory for complex control and processing functions.
  • Custom I/O platforms: Systems that need broad and flexible I/O counts for interfacing multiple peripherals, sensors, or external memory devices.
  • Industrial equipment: Embedded controllers and automation systems that benefit from an industrial operating temperature range and robust packaging.

Unique Advantages

  • High logic integration: 622,000 logic elements reduce the need for multiple devices, simplifying board-level design and lowering BOM complexity.
  • Large on-chip memory: Approximately 51.2 Mbits of embedded RAM supports data buffering and memory-hungry algorithms without immediate dependence on external memory.
  • Extensive I/O capability: 696 I/Os provide flexibility for dense connector routing and a wide variety of peripheral interfaces.
  • Industrial reliability: Rated for −40 °C to 100 °C operation to withstand demanding environmental conditions common in industrial applications.
  • Compact BGA package: 1517-ball FCBGA enables high-density mounting and thermal performance suitable for space-constrained systems.
  • Standards-conscious design: RoHS compliance supports environmentally responsible product development and supply-chain requirements.

Why Choose 5SGXEA7K3F40I3G?

The 5SGXEA7K3F40I3G positions itself as a high-capacity Stratix V GX FPGA for designs that demand large programmable logic, substantial embedded memory, and extensive I/O in an industrial-grade package. Its combination of 622,000 logic elements, approximately 51.2 Mbits of on-chip RAM, and 696 user I/Os makes it well suited for complex digital systems, custom interface platforms, and industrial control applications.

Engineers and procurement teams seeking a robust, high-density FPGA solution will find this device offers a balance of integration, thermal range, and compliance attributes that support scalable, long-lived designs.

Request a quote or submit an inquiry to evaluate the 5SGXEA7K3F40I3G for your next design and obtain detailed ordering and availability information.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up