5SGXEA7K3F40I3

The 5SGXEA7K3F40I3 is a Stratix V GX Field Programmable Gate Array offered in an industrial temperature grade and a 1517-BBGA FCBGA package. It provides high logic density and substantial on-chip memory suitable for designs that require extensive programmable logic, large embedded memory, and a wide complement of I/O.

Designed around the Stratix V GX architecture, this device is positioned for high-density, high-performance FPGA applications where reliable operation across a broad operating temperature range and a low-voltage core are required.

Key Features

• Core Logic  622,000 logic elements provide substantial programmable logic capacity for complex digital designs.
• Embedded Memory  Approximately 51.2 Mbits of total on-chip RAM for large buffering, LUT-based storage, and memory-intensive functions.
• I/O Density  696 user I/O pins to support wide parallel interfaces and extensive peripheral connectivity.
• Package & Mounting  1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40); surface-mount mounting type for compact board-level integration.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C to meet demanding environmental requirements.
• Core Voltage  Low-voltage core supply range of 820 mV to 880 mV for compatibility with low-power FPGA system designs.
• Standards & Compliance  RoHS-compliant to meet environmental and manufacturing requirements.

Typical Applications

• High-density logic implementations  Large combinational and sequential logic designs that need hundreds of thousands of logic elements and substantial embedded memory.
• Memory-intensive processing  Designs requiring tens of megabits of on-chip RAM for buffering, look-up tables, or local data storage.
• High-pin-count systems  Board-level systems that demand a large number of I/O for parallel interfaces and extensive peripheral connectivity.

Unique Advantages

• High logic capacity: 622,000 logic elements let you implement large, complex designs without immediate upscaling.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces reliance on external memory and simplifies board design.
• Robust I/O resources: 696 I/O pins enable flexible interfacing to multiple high-density peripherals and bus architectures.
• Industrial temperature rating: –40 °C to 100 °C operating range supports deployment in thermally demanding environments.
• Space-efficient package: 1517-BBGA FCBGA (40×40) delivers high pin-count in a compact surface-mount footprint for dense PCBs.
• Low-voltage core operation: 820 mV–880 mV supply supports integration into modern power-optimized systems.

Why Choose 5SGXEA7K3F40I3?

The 5SGXEA7K3F40I3 combines very large logic capacity, substantial on-chip memory, and a high I/O count in an industrial-grade Stratix V GX package. It is suited to designs that require a balance of programmable logic density, embedded RAM, and robust thermal performance.

For engineering teams and procurement specialists developing high-density FPGA solutions, this device provides a scalable platform with the electrical and environmental specifications needed for demanding applications.

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