5SGXEA7K3F40C3WN

The 5SGXEA7K3F40C3WN is a Stratix® V GX field programmable gate array (FPGA) in a 1517‑BBGA FCBGA package. It offers a high-capacity programmable core and extensive I/O in a surface-mount FBGA footprint for commercial applications.

With 622,000 logic elements, approximately 51.2 Mbits of embedded memory and 696 I/O pins, this device targets designs that require large programmable logic capacity, substantial on‑chip memory and dense board-level connectivity. The device operates within a core supply range of 820 mV to 880 mV and is specified for commercial temperature operation (0 °C to 85 °C).

Key Features

• Logic Capacity  622,000 logic elements for implementing large, parallel digital designs.
• Embedded Memory  Approximately 51.2 Mbits of on‑chip RAM to support large data buffers and state storage without external memory.
• I/O and Connectivity  696 I/O pins provide extensive external interfacing for peripherals, sensors and board-level connections.
• Package & Mounting  1517‑BBGA, FCBGA (supplier device package listed as 1517‑FBGA 40×40) in a surface-mount form factor suitable for production assembly.
• Power  Core supply voltage range: 820 mV to 880 mV.
• Operating Temperature  Commercial grade: 0 °C to 85 °C.
• Compliance  RoHS compliant.
• Documented Family Characteristics  Device family documentation covers electrical and switching characteristics, including transceiver specifications and I/O timing.

Typical Applications

• High‑density programmable logic  Implement complex digital algorithms and parallel processing using the device’s large logic element count and embedded memory.
• I/O‑intensive systems  Leverage 696 I/O pins for dense sensor, peripheral and board‑level interfacing.
• High‑speed serial connectivity  Use the device within designs that rely on Stratix V family transceiver and switching characteristics for fast serial links (see device documentation).

Unique Advantages

• High logic density: 622,000 logic elements accommodate large, complex FPGA designs without immediate partitioning across multiple devices.
• Substantial embedded memory: Approximately 51.2 Mbits of on‑chip RAM reduces dependence on external memory for buffering and state retention.
• Extensive I/O count: 696 I/O pins enable high channel counts and flexible board-level connectivity.
• Production-ready package: 1517‑BBGA FCBGA in a 40×40 supplier package supports standard surface-mount PCB assembly.
• Commercial temperature and defined power envelope: 0 °C to 85 °C operating range and 820–880 mV core supply for mainstream commercial deployments.
• RoHS compliant: Facilitates integration into lead‑free manufacturing flows.

Why Choose 5SGXEA7K3F40C3WN?

The 5SGXEA7K3F40C3WN combines high logic element count, significant on‑chip memory and a large I/O complement in a compact FBGA package, making it suitable for commercial designs that require dense programmable resources and extensive connectivity. Its documented Stratix V family electrical and switching characteristics provide the technical detail engineers need to evaluate timing, transceiver behavior and power.

This part is appropriate for projects requiring substantial programmable capacity and embedded RAM while maintaining a commercial temperature rating and RoHS compliance. Use it where on‑chip memory, high I/O density and a defined core voltage range are key selection criteria.

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