5SGXEA7K3F40C3G

The 5SGXEA7K3F40C3G is a Stratix V GX field-programmable gate array (FPGA) from Intel, delivered in a 1517-BBGA (1517-FBGA, 40×40) FCBGA package for surface-mount assembly. It provides a large on-chip logic fabric and embedded memory, with an operating supply range of 820 mV to 880 mV and a commercial temperature grade (0°C to 85°C).

This device is targeted at designs that require high logic capacity, substantial embedded RAM, and extensive I/O connectivity, while remaining within commercial temperature and voltage operating ranges.

Key Features

• Core Logic  Provides 622000 logic elements suitable for large-scale programmable logic implementations and complex design partitioning.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, lookup tables, and memory-intensive IP.
• I/O Count  696 user I/O pins to accommodate dense external interfacing and multi-channel connectivity requirements.
• Package & Mounting  1517-BBGA (1517-FBGA, 40×40) FCBGA package in a surface-mount form factor for high-density board integration.
• Power  Core supply operating range specified from 820 mV to 880 mV to match system power-rail design considerations.
• Temperature & Grade  Commercial grade device rated for 0°C to 85°C operating temperature.
• Compliance  RoHS-compliant for lead-free manufacturing and regulatory alignment.
• Series-Level Transceiver Options  Stratix V GX series documentation lists transceiver speed grades (series information) including options up to 14.1 Gbps and 12.5 Gbps, as outlined in the Stratix V device datasheet.

Typical Applications

• High-density logic designs  Leverage the 622000 logic elements for complex state machines, datapaths, and custom accelerators that require large programmable fabrics.
• Memory-intensive processing  Use the approximately 51.2 Mbits of embedded RAM for frame buffering, packet buffering, and LUT-heavy algorithms.
• Multi‑interface systems  Utilize 696 I/Os for designs that require extensive external connectivity, parallel interfaces, or multi-channel sensor/actuator aggregation.

Unique Advantages

• Extensive logic capacity: 622000 logic elements enable consolidation of large designs into a single device, reducing board-level complexity.
• Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM minimizes the need for external memory in many buffering and real-time processing tasks.
• High I/O density: 696 I/Os provide flexibility for complex system-level interconnects and multi-peripheral integration.
• Commercial-grade packaging: The 1517-BBGA FCBGA package offers a compact, surface-mount solution for high-density PCBs while matching standard manufacturing flows.
• Regulatory readiness: RoHS compliance supports lead-free assembly and broader market acceptance.

Why Choose 5SGXEA7K3F40C3G?

The 5SGXEA7K3F40C3G combines a high-density logic fabric, significant on-chip RAM, and a large I/O complement in a compact FCBGA package, making it well suited to commercial designs that demand integration and board-level consolidation. Its defined operating supply range and commercial temperature rating provide deterministic electrical and thermal boundaries for system design.

Backed by Intel's Stratix V device documentation, this device is a strong candidate for engineers and procurement teams seeking a high-capacity, commercial-grade FPGA with clear electrical and packaging specifications for integration into complex electronic systems.

Request a quote or submit a purchase inquiry today to evaluate the 5SGXEA7K3F40C3G for your next high-density FPGA design.