5SGXEA7K3F40C2WN

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 51200000 622000 1517-BBGA, FCBGA

Quantity 883 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7K3F40C2WN – Stratix® V GX FPGA, 622,000 Logic Elements, ~51.2 Mbits RAM, 696 I/Os

The 5SGXEA7K3F40C2WN is a Stratix® V GX field programmable gate array (FPGA) IC optimized for designs that require high logic density, significant on‑chip memory, and a large I/O footprint. As a member of the Stratix V GX family, the device is positioned for high‑performance digital and transceiver‑enabled applications where integration and scalability matter.

Key attributes include 622,000 logic elements, approximately 51.2 Mbits of embedded memory, 696 user I/Os, and a 1517‑BBGA FCBGA (40×40) package. The device ships as a commercial‑grade FPGA with a specified operating temperature range of 0 °C to 85 °C and RoHS compliance.

Key Features

  • Core Compute Capacity  622,000 logic elements provide substantial programmable fabric for complex digital designs and parallel processing implementations.
  • Embedded Memory  Approximately 51.2 Mbits of on‑chip RAM for buffering, lookup tables, and local data storage to support high‑throughput designs.
  • I/O Density  696 user I/Os enable broad connectivity options for parallel interfaces, external memory buses, and high‑pin‑count system integration.
  • Package  1517‑BBGA, FCBGA (supplier package: 1517‑FBGA, 40×40) supports compact, high‑density board layouts and surface‑mount assembly.
  • Power Supply  Core voltage supply specified from 870 mV to 930 mV to match system power‑delivery planning and enable predictable power budgeting.
  • Operating Grade & Temperature  Commercial grade device rated for 0 °C to 85 °C operation for a wide range of non‑industrial applications.
  • Surface Mount  Surface‑mount mounting type suitable for standard PCB assembly processes.
  • Regulatory Compliance  RoHS compliant, supporting lead‑free assembly and environmental requirements.

Typical Applications

  • High‑density digital processing  Leverage the large logic capacity and embedded RAM for FPGA‑based compute tasks, parallel datapaths, and custom acceleration.
  • High‑speed communications and transceiver designs  Stratix V GX family devices include high‑speed transceiver capabilities per device family documentation, making this part suitable for designs requiring high‑bandwidth interfaces and data movement.
  • Signal processing  Combine abundant logic elements and on‑chip memory for real‑time DSP, filtering, and data aggregation pipelines.
  • Complex I/O aggregation  Use the high I/O count to interface with multiple peripherals, parallel buses, and external memory arrays in constrained board layouts.

Unique Advantages

  • High logic density: 622,000 logic elements enable complex, large‑scale FPGA implementations without partitioning across multiple devices.
  • Substantial embedded memory: Approximately 51.2 Mbits of on‑chip RAM reduces dependency on external memory for many buffering and local‑storage needs, simplifying board design.
  • Large I/O complement: 696 I/Os provide flexibility for parallel interfaces, multi‑channel connectivity, and dense system integration.
  • Compact BGA footprint: 1517‑BBGA (40×40) package balances high pin count with a compact board area for space‑constrained systems.
  • Predictable power domain: Core supply specification of 870 mV–930 mV aids in power supply design and thermal planning.
  • Commercial readiness: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream electronic product deployments.

Why Choose 5SGXEA7K3F40C2WN?

This Stratix V GX FPGA part combines a high element count, generous embedded memory, and a large number of I/Os in a compact BGA package, making it suited for demanding digital, signal processing, and transceiver‑enabled system designs. Its commercial operating range and RoHS compliance make it appropriate for mainstream electronic products that require high integration and predictable electrical characteristics.

For teams building high‑performance FPGA solutions, the 5SGXEA7K3F40C2WN offers a scalable logic and memory resource set with a package and power specification designed to streamline board integration and system architecture planning.

Request a quote or submit a product inquiry to obtain pricing, availability, and additional technical documentation for 5SGXEA7K3F40C2WN.

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