5SGXEA7K3F35C3G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 51200000 622000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 699 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 432 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXEA7K3F35C3G – Stratix® V GX Field Programmable Gate Array (FPGA) IC, 622,000 logic elements, approximately 51.2 Mbits embedded memory, 432 I/Os, 1152-BBGA
The 5SGXEA7K3F35C3G is an Intel Stratix V GX family FPGA IC designed for customers requiring large logic capacity and significant on-chip memory. This commercial-grade, surface-mount device integrates 622,000 logic elements and approximately 51.2 Mbits of embedded RAM to support complex digital designs.
With 432 user I/Os, a low core voltage range (820 mV to 880 mV), and a 1152-ball BGA package (35 × 35 mm supplier device package), this device is tailored for applications that need high-density programmable logic, abundant I/O, and a compact FCBGA form factor.
Key Features
- Logic Capacity 622,000 logic elements for implementing large-scale digital functions and complex logic architectures.
- Embedded Memory Approximately 51.2 Mbits of on-chip RAM to support buffering, packet processing, and memory-intensive algorithms.
- I/O 432 user I/Os to accommodate wide parallel interfaces and multiple high-pin-count peripherals.
- Power and Core Supply Core voltage supply specified from 820 mV to 880 mV to match system power-rail design requirements.
- Package & Mounting 1152-ball BGA, FCBGA package (supplier device package: 1152-FBGA, 35 × 35 mm) optimized for surface-mount PCB assembly.
- Operating Range & Grade Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.
- Standards Compliance RoHS-compliant material designation for lead-free manufacturing processes.
- Manufacturer & Family Documentation Electrical and transceiver characteristics are covered in the Stratix V device datasheet for series-level reference.
Typical Applications
- High-density digital processing Use the large logic array and substantial embedded memory for complex signal processing pipelines and protocol processing.
- Multi-interface bridging Leverage 432 I/Os to connect multiple parallel busses, sensors, or high-pin-count peripherals in a single programmable device.
- Network and packet handling Combine abundant logic and on-chip RAM for packet buffering, classification, and custom networking accelerators.
Unique Advantages
- Large programmable capacity: 622,000 logic elements enable implementation of extensive custom logic and multiple functional blocks on one device.
- Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces the need for external memory in many buffering and streaming use cases.
- High I/O count: 432 user I/Os simplify board-level design by providing direct connectivity to numerous peripherals and interfaces.
- Compact BGA package: 1152-ball FCBGA (35 × 35 mm) offers a dense package footprint suitable for space-constrained system designs.
- Commercial-grade operating range: Specified for 0 °C to 85 °C operation, supporting standard commercial deployments and environments.
- Regulatory-friendly materials: RoHS compliance helps streamline manufacturing and environmental considerations.
Why Choose 5SGXEA7K3F35C3G?
The 5SGXEA7K3F35C3G delivers a balance of large logic capacity, substantial embedded memory, and a high I/O count in a compact 1152-ball BGA package. It is suited to designers who need extensive programmable logic and on-chip RAM in a commercial-temperature FPGA for complex digital, networking, or multi-interface applications.
Backed by Intel’s Stratix V family documentation, this device fits into development flows that require series-level electrical and transceiver references while providing the core resources to scale designs without fragmenting functionality across multiple ICs.
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