5SGXEA7K3F35C2LN

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 51200000 622000 1152-BBGA, FCBGA

Quantity 508 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7K3F35C2LN – Stratix® V GX FPGA IC, 622000 Logic Elements, 1152-BBGA

The 5SGXEA7K3F35C2LN is a Stratix® V GX field-programmable gate array (FPGA) IC designed for commercial-grade applications. The device provides substantial on-chip resources including 622,000 logic elements and approximately 51.2 Mbits of embedded memory, making it suitable for complex, high-density digital designs.

Featuring 432 I/O pins, a compact 1152-ball FCBGA package (35 × 35 mm), and a low-voltage core supply range of 820 mV to 880 mV, this FPGA targets designs that require a high logic capacity and dense I/O in a surface-mount form factor within a commercial operating temperature range (0 °C to 85 °C).

Key Features

  • Core Capacity  622,000 logic elements for large-scale logic integration and complex programmable logic designs.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, packet storage, and embedded data structures.
  • I/O Density  432 general-purpose I/O pins to support dense peripheral and interface connectivity.
  • Power Supply  Core voltage supply between 820 mV and 880 mV to match low-voltage FPGA power domains.
  • Package & Mounting  1152-ball FCBGA (35 × 35 mm) package in a surface-mount configuration for compact board-level integration.
  • Operating Grade & Temperature  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Regulatory Compliance  RoHS-compliant to meet modern materials and environmental requirements.

Unique Advantages

  • High logic density: 622,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
  • Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM supports larger buffers and state storage without external memory.
  • Wide I/O count: 432 I/Os provide flexibility to interface with numerous peripherals and multi-channel systems directly.
  • Compact, surface-mount package: The 1152-ball FCBGA (35 × 35 mm) package offers high integration density while preserving board real estate.
  • Commercial operating range: Rated for 0 °C to 85 °C, suitable for standard commercial electronic environments.
  • Material compliance: RoHS compliance simplifies regulatory management for product assemblies.

Why Choose 5SGXEA7K3F35C2LN?

The 5SGXEA7K3F35C2LN provides a combination of large programmable logic capacity, extensive embedded memory, and high I/O count in a compact FCBGA package—attributes that support integration of complex digital systems on a single FPGA. Its commercial temperature rating and RoHS compliance make it a practical choice for mainstream electronic products that require significant on-chip resources.

This device is positioned for designers and procurement teams seeking a high-capacity Stratix® V GX FPGA with clearly stated electrical and package characteristics. Its specification set supports scalable designs where logic density, embedded RAM, and I/O availability are primary selection criteria.

Request a quote or submit an inquiry to obtain pricing, availability, and ordering information for the 5SGXEA7K3F35C2LN.

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