5SGXEA7K3F35C2L

The 5SGXEA7K3F35C2L is a Stratix V GX family field programmable gate array (FPGA) from Intel, supplied in a 1152-BBGA FCBGA package for surface-mount applications. It provides a high-density programmable fabric intended for complex digital designs that require substantial logic capacity, embedded memory, and large I/O counts.

Designed as a commercial-grade device, this FPGA combines 622,000 logic elements with approximately 51.2 Mbits of embedded memory and 432 user I/Os, making it suitable for demanding system-level integration where high on-chip resource density and I/O connectivity are required.

Key Features

• Core logic  622,000 logic elements (LEs) to support large-scale custom logic, parallelism, and integration of complex functions on-chip.
• Embedded memory  Approximately 51.2 Mbits of on-chip RAM (total RAM bits: 51,200,000) for FIFOs, buffers, and tightly coupled data storage.
• I/O capacity  432 dedicated I/O pins provide extensive external connectivity for multi-channel interfaces and board-level integration.
• Package & mounting  1152-BBGA, FCBGA package (supplier package: 1152-FBGA, 35×35) in a surface-mount format for high-pin-count board designs.
• Power and core supply  Core supply voltage range specified at 820 mV to 880 mV for the device core operating region.
• Commercial temperature grade  Rated for operation from 0 °C to 85 °C and identified as a commercial-grade device.
• Standards compliance  RoHS compliant to support regulated manufacturing and environmental requirements.

Typical Applications

• High-density digital systems  Use the large logic capacity and embedded memory to consolidate multiple functions into a single programmable device.
• Protocol bridging and I/O aggregation  Leverage 432 I/Os to implement multi-protocol interfaces, aggregation, and board-level bridging between subsystems.
• Hardware acceleration and custom datapaths  Deploy the abundant logic elements and on-chip RAM to implement custom accelerators and high-throughput datapaths.
• Prototype and system integration  Apply the Stratix V GX fabric for system-level prototyping where high resource density and flexibility are required.

Unique Advantages

• High logic capacity: 622,000 logic elements enable consolidation of large or multiple logic functions into a single FPGA, reducing board-level complexity.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM supports deep buffering and local data storage without external memory dependencies.
• Extensive I/O: 432 I/Os provide flexibility for multi-channel designs and high-density interface routing on complex PCBs.
• Compact, high-pin package: 1152-BBGA (35×35) package delivers a high pin count in a compact footprint for space-constrained designs.
• Commercial operating range: Rated 0 °C to 85 °C for applications and environments aligned with commercial temperature requirements.
• RoHS compliant: Designed to meet RoHS requirements for environmentally conscious manufacturing processes.

Why Choose 5SGXEA7K3F35C2L?

The 5SGXEA7K3F35C2L combines a very large logic fabric, significant embedded memory, and a high I/O count in a compact, surface-mount BBGA package. As a Stratix V GX family device from Intel, it targets projects that need substantial on-chip resources and extensive external connectivity while operating within commercial temperature limits.

This part is appropriate for teams building large-scale programmable logic solutions—where integration density, on-chip memory, and I/O flexibility drive design decisions—and for organizations seeking a commercially graded FPGA option with RoHS compliance and clear electrical specifications.

Request a quote or submit a product inquiry to obtain pricing, availability, and technical support information for part number 5SGXEA7K3F35C2L.