5SGXEA7K2F40I3N

The 5SGXEA7K2F40I3N is a Stratix® V GX field-programmable gate array (FPGA) packaged in a 1517-BBGA (FCBGA) 40×40 supplier package. It delivers high on-chip logic and memory capacity alongside a large I/O count in a surface-mount BGA package for industrial-grade applications.

Designed for systems that require extensive programmable logic, embedded memory, and dense I/O connectivity, this device targets high-density signal processing, packet processing, and complex control implementations where robust operating range and industrial grade are required.

Key Features

• Programmable Logic  Provides 622,000 logic elements for implementing large-scale custom logic and complex digital functions.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support data buffering, FIFOs, and working memory for streaming and packet-processing designs.
• I/O Density  Up to 696 I/O pins to support high-pin-count interface requirements, parallel buses, and multi-channel connectivity.
• Power and Core Voltage  Specified core supply range from 820 mV to 880 mV to match targeted system power rails and power-management designs.
• Package and Mounting  1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40), designed for surface-mount PCB assembly.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Regulatory Compliance  RoHS compliant to meet modern environmental and manufacturing requirements.

Typical Applications

• High-performance Networking  Large logic capacity and abundant I/O enable packet processing, protocol bridging, and custom network acceleration.
• Data Center Acceleration  On-chip memory and extensive logic resources support hardware offload functions, ingress/egress buffering, and custom compute kernels.
• Industrial Control & Automation  Industrial temperature rating and high I/O count make the device suitable for motion control, PLCs, and multi-sensor aggregation.
• Signal Processing  Significant embedded RAM and logic resources facilitate real-time DSP pipelines, video preprocessing, and multi-channel data conditioning.

Unique Advantages

• High Logic Capacity: 622,000 logic elements allow integration of large, complex functions on a single device, reducing board-level component count.
• Substantial On‑Chip Memory: Approximately 51.2 Mbits of embedded RAM supports deep buffering and state storage without external memory for many use cases.
• Extensive I/O Connectivity: 696 I/O pins provide flexibility for interfacing multiple peripherals, high-speed buses, and multi-lane front-ends.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in harsh or temperature-variable installations.
• Compact BGA Package: 1517-BBGA (40×40) FCBGA packaging delivers high density in a compact surface-mount form factor suited to advanced PCB layouts.
• RoHS Compliant: Meets current lead-free and restricted-substance requirements for modern manufacturing processes.

Why Choose 5SGXEA7K2F40I3N?

The 5SGXEA7K2F40I3N combines a large pool of programmable logic, substantial embedded memory, and a high I/O count in an industrial-temperature, surface-mount BGA package. It is positioned for designs that require consolidated hardware functionality—reducing system complexity and enabling compact, high-performance implementations.

This device is well suited to engineers building dense compute, networking, and industrial control systems that benefit from on-chip memory, extensive I/O, and an industrial operating range. Its combination of capacity and package density supports scalable hardware designs and long-term deployment in temperature-challenging environments.

Request a quote or submit a product inquiry to sales for pricing, lead time, and availability details for the 5SGXEA7K2F40I3N.