5SGXEA7N3F40C2LN

IC FPGA 600 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 51200000 622000 1517-BBGA, FCBGA

Quantity 32 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7N3F40C2LN – Stratix® V GX FPGA, 622,000 logic elements, ~51.2 Mbits RAM, 600 I/Os, 1517-BBGA

The 5SGXEA7N3F40C2LN is an Intel Stratix V GX Field Programmable Gate Array (FPGA) IC that delivers a high-density programmable logic fabric and extensive on-chip memory. It is targeted for applications that require large logic capacity, substantial embedded RAM, and a high I/O count within a 1517-BBGA (FCBGA) package.

Device characteristics and electrical/switching parameters for this family are documented in the Stratix V device datasheet, supporting design integration and verification for commercial-grade systems.

Key Features

  • Logic Capacity  622,000 logic elements provide substantial programmable logic resources for complex digital designs.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support large buffering, state machines, and data paths.
  • I/O Density  600 user I/Os enable extensive external interfacing and parallel connectivity options.
  • Power and Core Supply  Core voltage supply specified from 820 mV to 880 mV for the device core domain.
  • Package & Mounting  1517-BBGA, FCBGA package; supplier device package listed as 1517-FBGA (40×40). Surface-mount mounting type for board-level assembly.
  • Operating Range  Commercial grade with operating temperature from 0 °C to 85 °C.
  • Compliance  RoHS compliant.
  • Documented Characteristics  Electrical and switching characteristics (including I/O timing and programmable I/O/periphery performance) are available in the Stratix V device documentation.

Unique Advantages

  • High logic integration: 622,000 logic elements reduce the need for multiple devices by consolidating complex functions into a single FPGA.
  • Substantial on-chip RAM: Approximately 51.2 Mbits of embedded memory supports large data buffering and on-device state retention without external memory for many use cases.
  • Large I/O complement: 600 I/Os enable broad peripheral and parallel interface support directly from the device.
  • Compact, high-density package: 1517-BBGA (1517-FBGA supplier designation, 40×40) delivers high pin-count in a surface-mount form factor suited for space-constrained boards.
  • Commercial temperature rating: Specified 0 °C to 85 °C operation for standard commercial environments.
  • Standards-compliant manufacturing: RoHS compliance supports environmentally conscious assembly processes.

Why Choose 5SGXEA7N3F40C2LN?

The 5SGXEA7N3F40C2LN places a very high level of programmable logic, embedded memory, and I/O capability into a single Stratix V GX device, making it suitable for commercial designs that require substantial on-chip resources and dense connectivity. Its documented electrical and switching characteristics facilitate integration and verification during design.

This part is appropriate for development teams and procurement organizations seeking a commercial-grade, high-density FPGA solution with clearly specified power, temperature, package, and I/O attributes backed by the Stratix V family documentation.

Request a quote or submit a purchase inquiry for 5SGXEA7N3F40C2LN through your preferred procurement channel to check availability and pricing.

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