5SGXEA7N3F40C2LG

The 5SGXEA7N3F40C2LG is a Stratix V GX Field Programmable Gate Array (FPGA) from Intel, offered in a 1517-BBGA FCBGA package. It delivers very high logic capacity and on-chip memory combined with a large I/O count for complex, high-density digital designs in commercial-temperature systems.

Designed for applications that require substantial programmable logic, embedded memory, and extensive I/O, this device targets high-performance communications, compute-acceleration, and complex system integration where a commercial-grade Stratix V GX FPGA is required.

Key Features

• Logic Capacity  622,000 logic elements suitable for large-scale digital designs and complex implementable functions.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-intensive algorithms.
• I/O Density  600 user I/O pins provide broad external connectivity for interfacing to high-pin-count peripherals and multi-channel systems.
• Package & Mounting  1517-BBGA (FCBGA) supplier device package 1517-FBGA (40×40); surface-mount package for compact board-level integration.
• Power Supply  Core voltage operating range of 820 mV to 880 mV to match platform power-rail design constraints.
• Operating Grade & Temperature  Commercial-grade device rated for 0 °C to 85 °C operation.
• Regulatory Compliance  RoHS compliant for lead-free board assembly and environmental requirements.

Typical Applications

• High-performance networking and communications  Leverages large logic resources and extensive I/O to implement protocol engines, packet processing, and interface bridging in commercial systems.
• Compute acceleration and signal processing  Substantial embedded RAM and logic elements support demanding DSP, streaming, and acceleration workloads.
• Complex system integration  High I/O count and the FCBGA package enable dense board-level integration for modular subsystems and multi-interface controllers.

Unique Advantages

• High on-chip logic capacity: 622,000 logic elements enable large, consolidated FPGA designs that reduce the need for multiple devices.
• Significant embedded memory: Approximately 51.2 Mbits of RAM supports large buffers and state storage for data-intensive applications.
• Extensive external connectivity: 600 I/O pins give designers flexibility to connect multiple peripherals, lanes, and interfaces without external multiplexing.
• Compact, board-ready package: 1517-BBGA (FCBGA) surface-mount package with a 1517-FBGA (40×40) supplier footprint supports dense PCB layouts.
• Commercial operating range: Rated for 0 °C to 85 °C, suitable for a wide range of commercial deployments.
• Regulatory compliance: RoHS compliant to meet lead-free assembly requirements.

Why Choose 5SGXEA7N3F40C2LG?

This Stratix V GX FPGA combines substantial logic capacity, large on-chip memory, and a high I/O count in a compact FCBGA package, making it well suited for engineers building high-density, performance-oriented commercial systems. Its commercial temperature rating and RoHS compliance simplify integration into production hardware while matching platform power-rail constraints with a defined core voltage range.

For designs that demand consolidated logic resources, significant embedded RAM, and broad external connectivity, the 5SGXEA7N3F40C2LG provides a verifiable, specification-driven option within the Stratix V GX family and is supported by the available device documentation.

Request a quote or submit an inquiry to start procurement or evaluation of the 5SGXEA7N3F40C2LG for your next FPGA design project.