5SGXEA7N3F40C2G

The 5SGXEA7N3F40C2G is a Stratix V GX FPGA in a high-density FCBGA package. As a Stratix V GX device, it combines large programmable logic capacity with the series’ transceiver-capable architecture for designs that require extensive logic, embedded memory and high I/O counts.

This commercial-grade FPGA targets applications that need significant on-chip resources and flexible I/O — delivering a combination of logic density, embedded RAM and transceiver-class architecture in a surface-mount 1517 FBGA footprint.

Key Features

• Core Logic Capacity — 622,000 logic elements providing extensive programmable logic for complex, high-density designs.
• Embedded Memory — Approximately 51 Mbits of on-chip RAM (51,200,000 bits) to support large buffers, FIFOs and state storage without external memory.
• I/O Resources — 600 I/O pins to support wide parallel interfaces, multi-channel designs and extensive connectivity.
• Transceiver-Capable Architecture — Device is a Stratix V GX part, consistent with the series’ transceiver architecture and related electrical/switching characteristics described in the Stratix V device documentation.
• Package and Mounting — 1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40). Surface-mount device suitable for high-pin-count board designs.
• Power — Core supply voltage specified at 870 mV to 930 mV for the device core domain.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• High‑speed serial interfaces and networking — Leverage the Stratix V GX transceiver-class architecture for designs that include high-speed serial links and protocol bridging.
• Compute‑intensive FPGA logic — Use the large logic array and on‑chip RAM for custom parallel processing, signal processing pipelines and hardware acceleration functions.
• High‑pin‑count systems — 600 I/O pins and the 1517 FCBGA package enable dense board-level connectivity for multi-channel and multi‑interface applications.

Unique Advantages

• High density programmable logic: 622,000 logic elements reduce the need to partition designs across multiple devices.
• Substantial on‑chip memory: Approximately 51 Mbits of embedded RAM supports large buffers and temporary data storage without immediate external memory reliance.
• Extensive I/O count: 600 I/Os provide flexibility for broad parallel interfaces and mixed-signal front-end connections.
• Compact, high‑pin package: The 1517 FCBGA package consolidates high pin-count connectivity in a surface-mount footprint suited to dense PCBs.
• Commercial-grade suitability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.
• Defined core supply window: Core voltage specified between 870 mV and 930 mV for clear power-system design and margining.

Why Choose 5SGXEA7N3F40C2G?

5SGXEA7N3F40C2G places a large pool of programmable logic, substantial embedded RAM and a high I/O count into a single Stratix V GX FCBGA package. It is well suited to commercial designs that demand integrated logic capacity and the transceiver-class architecture of the Stratix V GX series.

For engineers building complex logic-rich systems with heavy I/O requirements or transceiver-enabled interfaces, this device offers a consolidated platform that supports scalable designs while aligning to defined commercial operating and power parameters.

Request a quote or submit an inquiry to learn about availability, pricing and how 5SGXEA7N3F40C2G can fit into your next high-density FPGA design.