5SGXEA7N2F45I3N

The 5SGXEA7N2F45I3N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, supplied in a 1932-ball FBGA (FCBGA) package. This device delivers a large programmable fabric with dedicated embedded memory and extensive I/O for designs that require high logic density and advanced serial I/O capability within an industrial temperature grade.

Key on-chip resources include 622,000 logic elements and approximately 51.2 Mbits of embedded RAM, combined with 840 user I/O pins and GX-class transceiver support as documented for the Stratix V GX family. The device is specified for industrial operation and RoHS compliant.

Key Features

• Programmable Logic — 622,000 logic elements provide a substantial programmable fabric for complex digital designs and high-density logic implementation.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM to support buffering, local data storage, and memory-intensive processing functions.
• High I/O Count — 840 user I/O pins enable broad connectivity for parallel interfaces, control signals, and board-level integration.
• GX Transceiver Capability — As part of the Stratix V GX family, GX channel transceivers are supported (Stratix V GX device datasheet lists GX channel speeds up to 14.1 Gbps), enabling high-speed serial links where required.
• Power — Core supply specified between 820 mV and 880 mV to match Stratix V core voltage requirements.
• Package & Mounting — 1932-ball BGA (FCBGA) package, supplier device package listed as 1932-FBGA, FC (45×45); surface-mount mounting type for standard board assembly.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployments in industrial environments.
• Standards Compliance — RoHS compliant to support regulatory requirements for lead-free assembly.

Typical Applications

• High-density digital processing — Large logic capacity (622,000 logic elements) and substantial embedded RAM support complex algorithm implementation and parallel processing pipelines.
• High-speed serial communications — GX transceiver capability in the Stratix V GX family (documented up to 14.1 Gbps) suits designs requiring multi‑Gbps serial links and backplane connectivity.
• Industrial control and instrumentation — Industrial temperature grade (−40 °C to 100 °C) and high I/O count (840) enable robust I/O interfacing and control system integration.

Unique Advantages

• Large programmable fabric: 622,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces external memory dependence for buffering and local data storage.
• Extensive I/O flexibility: 840 user I/Os provide flexibility for mixed parallel and serial interfaces across complex designs.
• Industrial-rated operation: −40 °C to 100 °C operating range supports deployment in a wide range of industrial environments.
• Package density: 1932-ball FCBGA (45×45) package offers a compact, surface-mount solution for high-pin-count FPGA deployment.
• Regulatory readiness: RoHS compliance facilitates lead-free manufacturing and global environmental requirements.

Why Choose 5SGXEA7N2F45I3N?

The 5SGXEA7N2F45I3N Stratix® V GX FPGA combines a very large logic fabric, substantial embedded memory, and a high pin count in a 1932‑ball FCBGA package engineered for industrial temperature operation. These attributes make it suitable for designs that require dense logic integration, on-chip buffering, and extensive I/O or high-speed serial links.

For engineering teams targeting scalable, high‑density FPGA solutions within Intel’s Stratix V GX family, this part provides a verifiable set of resources and environmental ratings that support long-term deployments and complex system integration.

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