5SGXEA7N2F45I3G

The 5SGXEA7N2F45I3G is a Stratix V GX field-programmable gate array (FPGA) IC manufactured by Intel. It provides a high-density programmable fabric tailored for designs that require a large number of logic elements, substantial on-chip memory, and extensive I/O connectivity.

This device is offered in an industrial grade with specifications and documentation that cover electrical and switching characteristics, including transceiver and I/O timing details for designs leveraging the Stratix V family.

Key Features

• Core Logic  622,000 logic elements for implementing complex, high-density logic designs.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support large data buffering, state machines, and local storage.
• I/O Capacity  840 user I/Os to support wide parallel interfaces, large bus fabrics, and multiple peripheral connections.
• Power Supply  Core voltage supply range 820 mV to 880 mV to match system power architecture and core performance requirements.
• Package & Mounting  1932-BBGA (FCBGA) package, supplier device package listed as 1932-FBGA, FC (45×45), provided as a surface-mount device.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in temperature-demanding environments.
• Standards Compliance  RoHS compliant for environmental and manufacturing process requirements.
• Stratix V Family Documentation  Device datasheet coverage includes electrical and switching characteristics, transceiver specifications, and I/O timing guidance for design validation.

Typical Applications

• High-density programmable logic systems  Use the device where large-scale logic implementation and deep on-chip memory are required for custom digital processing.
• I/O-intensive interface and control platforms  Leverage 840 I/Os for multi-channel interfaces, wide buses, or complex peripheral aggregation.
• Industrial embedded systems  Industrial temperature rating and surface-mount BGA packaging make the device suitable for robust embedded applications operating from −40 °C to 100 °C.
• Designs requiring documented transceiver and I/O timing  Beneficial for systems that rely on the Stratix V family’s documented electrical and switching characteristics.

Unique Advantages

• Massive logic capacity: 622,000 logic elements enable integration of complex functions and consolidation of multiple subsystems onto a single FPGA.
• Substantial on-chip RAM: Approximately 51.2 Mbits of embedded memory reduces external memory dependence and improves data locality.
• Extensive I/O scaling: 840 I/Os support high-channel-count designs and flexible interface options without adding external glue logic.
• Industrial temperature capability: −40 °C to 100 °C operation supports deployment in demanding thermal environments.
• Compact, manufacturable package: 1932-BBGA FCBGA surface-mount package (1932-FBGA, FC 45×45) simplifies board-level integration for dense systems.
• Low-voltage core operation: 0.82–0.88 V supply range enables alignment with modern power-rail architectures.
• RoHS compliant: Meets common environmental compliance requirements for electronic assemblies.

Why Choose 5SGXEA7N2F45I3G?

The 5SGXEA7N2F45I3G positions itself as a high-density Stratix V GX FPGA option for projects that demand large logic capacity, significant embedded RAM, and broad I/O resources within an industrial temperature envelope. Its documented electrical and switching characteristics from the Stratix V family provide guidance for designs that require careful timing and transceiver considerations.

This device is suitable for engineers and procurement teams focused on consolidating complex digital functions, reducing external memory and interface components, and deploying robust systems that operate across a wide temperature range.

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