5SGXEA7N2F45I3L

The 5SGXEA7N2F45I3L is an Intel Stratix® V GX Field Programmable Gate Array (FPGA) IC designed for high-density programmable logic implementations. The device provides 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 840 user I/O pins in a high-pin-count BGA package.

Built and specified for industrial environments, this Stratix V GX-class device targets designs that require significant on-chip logic and memory capacity along with extensive external interfacing and reliable operation across a wide temperature range.

Key Features

• Logic Capacity  Provides 622,000 logic elements to support large, complex custom logic designs and high integration of digital functions.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to store buffers, tables, and intermediate data without external memory in many use cases.
• I/O and Package  840 user I/O pins in a 1932-BBGA (FCBGA) package; supplier package listed as 1932-FBGA, FC (45 × 45), and surface-mount mounting for dense board integration.
• Power Delivery  Core voltage supply specified from 820 mV to 880 mV to meet the device’s operating requirements.
• Operating Range  Industrial-grade device rated for operation from –40 °C to 100 °C, suitable for a wide range of temperature-demanding applications.
• Compliance  RoHS-compliant construction for environmental and regulatory alignment.

Typical Applications

• High-density custom logic implementations  Large-scale programmable logic functions and complex state machines using 622,000 logic elements and substantial embedded memory.
• I/O-intensive systems  Designs that require numerous external interfaces and signal routing take advantage of the device’s 840 I/O pins and high-pin-count BGA package.
• Industrial embedded platforms  Industrial-grade temperature range (–40 °C to 100 °C) and RoHS compliance make this device suitable for demanding embedded systems.

Unique Advantages

• High logic integration: 622,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level complexity and BOM count.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM supports data buffering, LUT tables, and working storage without immediate dependence on external memory.
• Extensive external interfacing: 840 I/O pins and a 1932-BBGA package provide the physical connectivity required for multi-channel and multi-peripheral systems.
• Industrial temperature capability: Specified operation from –40 °C to 100 °C supports reliable deployment in temperature-challenging environments.
• Compact surface-mount package: The 1932-FBGA (45 × 45) form factor enables dense PCB layouts while maintaining high signal-count routing.
• Regulatory alignment: RoHS compliance supports environmental and manufacturing standards for modern electronic products.

Why Choose 5SGXEA7N2F45I3L?

The 5SGXEA7N2F45I3L positions itself as a high-capacity Stratix V GX FPGA option for designs that require a combination of large logic resources, substantial embedded memory, and extensive I/O connectivity delivered in a high-pin-count BGA package. Its industrial temperature rating and RoHS compliance provide a practical balance of integration and environmental suitability for embedded and industrial applications.

This device is appropriate for engineering teams and procurement focused on scalable, high-density FPGA solutions where on-chip resources and broad interfacing capability reduce system-level complexity and accelerate time to prototype and production.

Request a quote or submit a product inquiry to start the procurement process for the 5SGXEA7N2F45I3L and evaluate how its logic capacity, memory, and I/O density fit your next design.