5SGXEA7N2F45I3

The 5SGXEA7N2F45I3 is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel designed for high-density programmable logic applications. It provides a large logic fabric and extensive on-chip resources in a high-pin-count BGA package for integration into complex systems.

Targeted at industrial applications and other markets that require robust operation, the device combines a substantial logic capacity with significant embedded memory and a wide I/O complement, plus industrial temperature operation and surface-mount packaging for dense PCB layouts.

Key Features

• Core logic capacity — 622,000 logic elements (cells) for implementing large-scale digital designs and deep compute logic.
• Embedded memory — Approximately 51.2 Mbits of total on-chip RAM, enabling on-chip buffering and local data storage without immediate reliance on external memory.
• I/O density — 840 user I/Os to support extensive connectivity and parallel interfaces directly from the FPGA.
• Package and mounting — 1932-BBGA, FCBGA (supplier package: 1932-FBGA, FC, 45×45); surface-mount mounting for compact, high-density board designs.
• Power supply range — Core voltage supply specified from 820 mV to 880 mV to match system power-rail requirements.
• Industrial temperature grade — Rated for operation from −40 °C to 100 °C for deployment in extended-temperature environments.
• RoHS compliant — Device is RoHS compliant, supporting regulatory requirements for lead-free assemblies.

Typical Applications

• Industrial control and automation — Large logic capacity and industrial temperature rating support complex control algorithms and long-term field operation.
• High-density I/O subsystems — 840 I/Os enable aggregation and routing of many signals for switch fabrics, protocol bridging, or custom I/O expansions.
• Signal processing and buffering — Approximately 51.2 Mbits of embedded memory allow on-chip data buffering for streaming and real-time processing tasks.
• System-level integration and prototyping — High logic count and a compact 1932-BBGA package facilitate integration of multiple functions into a single programmable device for prototype and production designs.

Unique Advantages

• Substantial on-chip logic: 622,000 logic elements reduce the need for external ASICs or multiple FPGAs when implementing complex functions.
• Significant embedded memory: Approximately 51.2 Mbits of RAM supports larger on-chip data structures and buffering, simplifying board-level memory architectures.
• Extensive I/O count: 840 user I/Os provide flexibility for multi-channel interfaces and dense connector mappings without extensive external multiplexing.
• Industrial temperature capability: −40 °C to 100 °C rating enables deployment in harsher or temperature-variable environments.
• High-pin-count BGA package: 1932-BBGA (45×45) supports high routing density and compact system designs while remaining surface-mount compatible.
• Controlled core voltage envelope: Defined supply range of 820 mV to 880 mV facilitates predictable power design and compatibility with specific power rails.

Why Choose 5SGXEA7N2F45I3?

The 5SGXEA7N2F45I3 positions itself for designs that require a large programmable fabric combined with substantial on-chip memory and a high I/O count within an industrial temperature window. Its combination of 622,000 logic elements, approximately 51.2 Mbits of embedded RAM, and 840 I/Os provides the density needed for complex signal processing, control, and integration tasks.

Packaged in a 1932-BBGA surface-mount form factor and supplied by Intel, this Stratix V GX device is suited to teams building high-density, industrial-grade systems that benefit from consolidated logic, on-chip resources, and a compact board footprint.

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