5SGXEA7N2F45I2N

The 5SGXEA7N2F45I2N is a Stratix® V GX field programmable gate array (FPGA) manufactured by Intel. It provides a large logic capacity, extensive on-chip memory, and a high I/O count in a high-density FCBGA package targeted for industrial-temperature operation.

With 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 840 I/Os, this device is intended for high-density FPGA designs that require significant logic resources, substantial local RAM, and wide external connectivity while operating across an industrial temperature range.

Key Features

• Core logic density — 622,000 logic elements to support complex digital designs and large-scale integration.
• Embedded memory — Approximately 51.2 Mbits of on-chip RAM for buffering, frame storage, and local data processing.
• High I/O count — 840 I/Os to enable broad interfacing options with peripherals, memories, and system-level signals.
• Package and mounting — 1932-BBGA, FCBGA package (supplier device package: 1932-FBGA, FC (45x45)) with surface-mount assembly.
• Industrial temperature rating — Operating temperature range from −40 °C to 100 °C for deployment in industrial environments.
• Power supply — Core supply voltage specified between 870 mV and 930 mV to meet device operating requirements.
• RoHS compliant — Device meets RoHS environmental requirements.

Typical Applications

• High-density FPGA systems — Designs that require large logic capacity and extensive on-chip memory for compute and control tasks.
• Multi-interface platforms — Systems needing a high number of I/Os to interface with multiple external devices and subsystems.
• Industrial equipment — Applications operating across −40 °C to 100 °C that require robust FPGA-based control, timing, or processing functions.

Unique Advantages

• Large logic fabric: 622,000 logic elements enable complex hardware designs and significant parallelism without external logic expansion.
• Substantial local memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and processing tasks.
• Extensive connectivity: 840 I/Os provide flexibility for dense board-level integrations and multi-interface requirements.
• Industrial temperature capability: Rated for −40 °C to 100 °C operation to support deployments in industrial environments.
• Compact, standard package: 1932-FBGA (45×45) FCBGA package supports surface-mount assembly for production-friendly integration.
• Regulatory alignment: RoHS compliance supports environmentally conscious manufacturing and assembly processes.

Why Choose 5SGXEA7N2F45I2N?

The 5SGXEA7N2F45I2N balances very high logic capacity, ample embedded RAM, and wide I/O availability in a single Stratix V GX FPGA package from Intel. Its industrial temperature rating and defined core voltage range make it appropriate for demanding, long-life industrial systems where on-chip resources and I/O density are primary design drivers.

This device is suited to engineering teams developing high-density FPGA-based solutions that require scalability, robust thermal range, and integration into surface-mount assembly flows while maintaining compliance with RoHS requirements.

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