5SGXEA7N2F45I2L

The 5SGXEA7N2F45I2L is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel. It delivers high-density programmable logic with extensive I/O and embedded memory in a 1932-BBGA FCBGA package for surface-mount applications.

As a member of the Stratix V GX family, the series-level datasheet documents transceiver speed-grade options and industrial temperature offerings, making this device suitable for designs that require dense logic, substantial on-chip RAM, and robust I/O capacity.

Key Features

• Core Logic  Approximately 622,000 logic elements for implementing large-scale programmable logic functions.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, lookup tables, and intermediate data storage.
• I/O Density & Package  Up to 840 user I/Os in a 1932-BBGA (supplier package: 1932-FBGA, FC 45×45) providing extensive external connectivity in a compact ball-grid format.
• Power Supply  Core voltage range specified at 820 mV to 880 mV to meet platform power requirements.
• Thermal & Grade  Industrial grade device with an operating temperature range of −40 °C to 100 °C for deployment in temperature-demanding environments.
• Mounting  Surface-mount package suitable for modern PCB assembly processes.
• Compliance  RoHS compliant.
• Series-Level Transceiver Options  Stratix V GX family datasheet documents transceiver speed-grade options (series-level information) for high-speed serial connectivity applications.

Typical Applications

• High-speed Communications  Leverage the Stratix V GX family transceiver capabilities and 840 I/Os for networking equipment and protocol bridging where dense I/O and series-level high-speed links are required.
• Data Processing & Acceleration  Use the large logic element count and ~51.2 Mbits of embedded memory for custom data-paths, packet processing, and hardware acceleration functions.
• Industrial Control & Instrumentation  Industrial temperature rating and robust I/O count enable deployment in control systems and instrumentation that require reliable operation across −40 °C to 100 °C.

Unique Advantages

• High logic density: Approximately 622,000 logic elements allow consolidation of complex functions into a single device, reducing board-level component count.
• Substantial on-chip memory: Around 51.2 Mbits of embedded RAM supports large buffers and state storage directly on-chip, minimizing external memory dependence.
• Extensive I/O in a compact package: 840 I/Os in a 1932-BBGA footprint provide high external connectivity while maintaining a manageable PCB area.
• Industrial temperature range: Rated for −40 °C to 100 °C for deployment in temperature-challenging environments without additional temperature qualification claims.
• Controlled core power range: Defined supply window (820 mV–880 mV) aids in predictable power delivery and thermal planning.
• Standards-oriented compliance: RoHS compliance simplifies environmental and regulatory planning for assemblies incorporating the device.

Why Choose 5SGXEA7N2F45I2L?

The 5SGXEA7N2F45I2L positions itself as a high-density Stratix V GX FPGA option with a balance of logic capacity, embedded memory, and broad I/O—all packaged in a 1932-BBGA surface-mount format and rated for industrial temperatures. These attributes make it suitable for designs that need substantial on-chip resources and reliable operation across a wide temperature range.

Engineers selecting this device benefit from explicit, verifiable specifications—logic element count, on-chip RAM, I/O count, package dimensions, supply-voltage window, and operating temperature—that support system-level planning, power budgeting, and thermal design.

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