5SGXEA7N2F45I2G

The 5SGXEA7N2F45I2G is an Intel Stratix V GX field programmable gate array (FPGA) in a 1932-ball FCBGA package designed for high-density, I/O‑rich designs. It combines a large logic fabric with substantial embedded memory and a wide I/O count to address complex digital processing tasks.

This device is offered in an industrial temperature grade (–40 °C to 100 °C) and supports a core supply range of 870 mV to 930 mV, making it suitable for designs that require high integration, robust operating range, and extensive on-chip resources.

Key Features

• High Logic Density 622,000 logic elements provide extensive programmable logic capacity for complex algorithms and custom datapaths.
• Embedded Memory Approximately 51.2 Mbits of on-chip RAM to support large buffers, LUT-based storage, and memory-intensive functions.
• Large I/O Count 840 user I/Os enable high-pin-count interfaces, multi-channel connectivity, and dense board-level integration.
• Packaging & Mounting Supplied in a 1932-BBGA (FCBGA) footprint with supplier device package specified as 1932-FBGA, FC (45×45); surface-mount mounting for compact, board-level deployment.
• Power Supply Range Core voltage supply specified from 870 mV to 930 mV to match regulated core power rails and system power budgets.
• Industrial Temperature Grade Rated for operation from –40 °C to 100 °C for use in temperature-challenging environments.

Typical Applications

• High-density digital processing — Large logic capacity and embedded memory support custom compute acceleration, packet processing, and complex control logic.
• High-pin-count interfacing — 840 I/Os provide the signal density needed for multi-channel data acquisition, protocol bridging, and dense peripheral connectivity.
• Industrial systems — Industrial temperature rating and robust packaging make the device suitable for factory automation, instrumentation, and control applications.

Unique Advantages

• Substantial programmable fabric: 622,000 logic elements enable implementation of large finite-state machines, datapaths, and custom accelerators on a single device.
• Large on-chip RAM: Approximately 51.2 Mbits of embedded memory reduce external memory dependence for buffering and data staging.
• Extensive I/O capability: 840 I/Os simplify board-level routing and allow consolidation of multiple interfaces without external multiplexing.
• Industrial-grade operation: –40 °C to 100 °C rating supports deployment in thermally demanding environments.
• Compact BGA implementation: 1932-BBGA (FCBGA) package and surface-mount mounting enable high-density PCB layouts and automated assembly.
• Defined core supply window: 870 mV–930 mV core supply specification supports predictable power provisioning and system integration.

Why Choose 5SGXEA7N2F45I2G?

The 5SGXEA7N2F45I2G positions itself for designs that require a high level of integration: significant logic capacity, large embedded memory, and a broad I/O count in a production-ready FCBGA package. Its industrial temperature rating and defined core voltage range help ensure consistent operation across demanding environments.

This device is appropriate for engineering teams building complex digital systems that need to consolidate functions, reduce external components, and maintain robust thermal and electrical margins. It offers a clear path for scalable, high-density FPGA implementations with Intel Stratix V GX family characteristics.

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