5SGXEA7N2F45C3WN

The 5SGXEA7N2F45C3WN is a Stratix V GX field-programmable gate array (FPGA) IC designed for commercial-grade applications that require large logic capacity, extensive I/O, and significant on-chip memory. It integrates a high density of logic elements and embedded RAM to address complex digital designs.

This device is supplied in a 1932-BBGA FCBGA package (1932-FBGA, FC, 45×45) for surface-mount assembly and operates with a core voltage range of 820 mV to 880 mV within a commercial temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Core Logic Capacity 622,000 logic elements to support large-scale programmable logic implementations and complex fabric utilization.
• Embedded Memory Approximately 51.2 Mbits of on-chip RAM for high-bandwidth buffering, data storage, and state machine implementations.
• High-Density I/O 840 device I/Os to accommodate wide parallel interfaces, multiple peripherals, and extensive board-level connectivity.
• Package & Mounting 1932-BBGA FCBGA package (supplier package: 1932-FBGA, FC 45×45) supplied for surface-mount PCB assembly and space-efficient integration.
• Power Supply Core voltage specified from 820 mV to 880 mV for power planning and regulator selection.
• Commercial Temperature Grade Rated for operation from 0 °C to 85 °C, matching typical commercial-environment deployments.
• Regulatory / Environmental RoHS compliant to meet common environmental material requirements.

Typical Applications

• High-density digital systems — Use the large logic element count to implement complex state machines, custom processors, and deep datapath logic.
• Memory-intensive FPGA designs — Leverage approximately 51.2 Mbits of embedded RAM for buffering, packet storage, or on-chip data structures.
• I/O-rich applications — Deploy in designs that require many parallel or serial interfaces enabled by 840 available I/Os.

Unique Advantages

• Substantial logic resources: 622,000 logic elements provide headroom for large designs and multi-function integration on a single device.
• Significant embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces dependence on external memory for many common use cases.
• Extensive I/O capability: 840 I/Os simplify system partitioning and enable broad peripheral and interface support without external multiplexing.
• Compact, high-pin-count package: 1932-BBGA FCBGA (45×45) balances pin density and PCB footprint for space-constrained boards.
• Commercial temperature rating: 0 °C to 85 °C is suitable for mainstream electronic applications and typical deployment environments.
• RoHS compliant: Aligns with standard environmental and materials requirements for commercial products.

Why Choose 5SGXEA7N2F45C3WN?

The 5SGXEA7N2F45C3WN positions itself as a high-capacity Stratix V GX FPGA for commercial applications that need a combination of large logic density, abundant embedded RAM, and extensive I/O. Its 1932-BBGA package and surface-mount form factor enable compact board designs while supporting complex system integration.

Engineers and procurement teams will find this part appropriate for projects that require scalable programmable logic resources with documented electrical and switching characteristics provided in the Stratix V device datasheet. The device’s specifications support robust design planning for power, thermal, and I/O budgeting in commercial-grade systems.

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