5SGXEA7N2F45C3G

The 5SGXEA7N2F45C3G is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, offered in a 1932-BBGA (FCBGA) package. It combines very large logic capacity and embedded memory with a high pin count to address complex digital integration requirements.

Designed for commercial-grade deployments, this device provides a substantial on-chip resource set—622,000 logic element cells, approximately 51.2 Mbits of embedded memory, and 840 I/Os—making it suitable where high logic density, significant embedded RAM, and extensive connectivity are required.

Key Features

• Logic Capacity  622,000 logic element cells to implement large-scale digital designs and complex custom logic.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, lookup tables, and state storage without external memory.
• High I/O Count  840 user I/Os to support broad peripheral connectivity and dense signal interfacing.
• Package & Mounting  1932-BBGA (FCBGA) package, supplier device package listed as 1932-FBGA, FC (45×45); surface-mount device for PCB assembly.
• Power Supply  Specified voltage supply range of 820 mV to 880 mV.
• Operating Conditions  Commercial temperature grade with an operating temperature range of 0°C to 85°C.
• Regulatory  RoHS compliant.

Typical Applications

• High-density digital integration  Implement large custom logic blocks and complex state machines using the device’s 622,000 logic elements.
• On-chip buffering and data storage  Leverage approximately 51.2 Mbits of embedded memory for packet buffering, LUTs, and intermediate data storage without relying on external RAM.
• High-pin-count interface systems  Utilize 840 I/Os for systems requiring extensive peripheral or parallel I/O connectivity on a single FPGA.

Unique Advantages

• Massive logic scale: 622,000 logic elements enable integration of large subsystems on a single FPGA, reducing board-level complexity.
• Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM minimizes external memory dependence for many buffering and storage needs.
• Extensive I/O: 840 I/Os provide design flexibility for dense interface requirements, cable routing, and multi-channel systems.
• Compact FCBGA packaging: 1932-BBGA (FCBGA) delivers high pin density in a surface-mount form factor suitable for compact PCBs.
• Commercial-grade operating window: Rated for 0°C to 85°C operation and RoHS compliant for broad commercial applications.

Why Choose 5SGXEA7N2F45C3G?

The 5SGXEA7N2F45C3G positions itself as a high-capacity Stratix V GX FPGA option for designs that require large logic resources, significant on-chip RAM, and a high number of I/Os in an FCBGA package. Its specification set supports consolidation of complex digital functions onto a single device, simplifying system architecture and reducing component count.

Engineers and procurement teams seeking a commercial-grade, RoHS-compliant FPGA with a clear specification for logic elements, embedded memory, I/O count, package, supply-voltage range, and operating temperature will find this device aligned with demanding integration needs while remaining within the documented commercial temperature grade.

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