5SGXEA7N2F45C3N

The 5SGXEA7N2F45C3N is a Stratix® V GX Field Programmable Gate Array from Intel, delivered in a 1932-BBGA FCBGA surface-mount package. This commercial-grade FPGA combines high logic density and substantial on-chip memory with a large I/O count to support complex, high-performance digital designs.

As a Stratix V GX family device (series datasheet references transceiver speed grades), the device targets designs that require extensive programmable logic, embedded memory, and flexible I/O in a compact, RoHS-compliant package.

Key Features

• High Logic Density — 622,000 logic elements to implement large custom logic, protocol engines, and control fabrics.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• Extensive I/O — 840 I/O pins to support broad external connectivity and high pin-count interfacing.
• Package & Mounting — 1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount design suitable for compact system boards.
• Power Supply — Core voltage supply range of 820 mV to 880 mV for the device core.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature for commercial applications.
• Standards & Compliance — RoHS compliant for lead-free assembly and regulatory alignment.
• Stratix V GX Family Characteristics — Series documentation for Stratix V GX devices includes graded transceiver speed options and electrical/switching characteristics useful for high-speed designs.

Typical Applications

• Communications & Networking — Implement protocol processing, packet engines, and high-speed interfaces leveraging the Stratix V GX family’s transceiver-capable architecture (series datasheet references transceiver speed grades).
• Data Processing & Acceleration — Large logic capacity and substantial embedded RAM allow implementation of custom accelerators, offload engines, and complex datapaths.
• Test & Measurement Systems — High I/O count and flexible logic resources suit instrument control, data aggregation, and real-time signal processing.
• Prototyping & System Integration — Surface-mount 1932-BBGA package and commercial temperature rating make the device suitable for compact prototypes and production systems aimed at commercial markets.

Unique Advantages

• Large Programmable Fabric: 622,000 logic elements provide the capacity to consolidate multiple functions into a single device, reducing BOM and board complexity.
• Substantial On-Chip Memory: Approximately 51.2 Mbits of embedded RAM enables local buffering and low-latency data paths without external memory for many use cases.
• High Pin Count: 840 I/O pins allow broad external connectivity and flexible partitioning of interfaces across the system.
• Compact, Board-Ready Package: 1932-BBGA (45×45) surface-mount package supports dense board layouts while maintaining a high I/O and logic capacity.
• Commercial Temperature & RoHS Compliance: Rated 0 °C to 85 °C and RoHS compliant to align with standard commercial product manufacturing and regulatory requirements.
• Predictable Core Power: Documented core voltage range (820–880 mV) simplifies power-supply design and thermal planning for system integrators.

Why Choose 5SGXEA7N2F45C3N?

The 5SGXEA7N2F45C3N positions itself as a high-density, memory-rich Stratix V GX FPGA suitable for demanding commercial designs that require extensive programmable logic, substantial embedded RAM, and large I/O connectivity in a single package. Its specification set supports complex datapaths, protocol implementations, and I/O-heavy systems while fitting compact board footprints.

Engineers and system designers targeting scalable, high-performance FPGA implementations will find the combination of logic capacity, on-chip memory, and package density valuable for reducing system complexity and accelerating time to market—all backed by Intel’s Stratix V family documentation and device electrical characteristics.

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