5SGXEA7N2F45I2CV

The 5SGXEA7N2F45I2CV is a Stratix® V GX Field Programmable Gate Array (FPGA) in a 1932‑BBGA FCBGA package. It provides a high count of programmable logic resources, large on‑chip memory, and extensive I/O capability for complex, high‑density designs.

Specified for industrial operation, this device supports a wide operating temperature range and a low‑voltage core supply, making it suitable for designs that require substantial logic and memory integration with robust thermal tolerance.

Key Features

• Logic Capacity — 622,000 logic elements (cells) to implement large-scale programmable logic and complex custom architectures.
• Embedded Memory — Approximately 51.2 Mbits of on‑chip RAM for data buffering, LUT storage, and embedded data structures.
• I/O Density — 840 user I/O pins to support high‑pin‑count interfacing with peripherals, memory, and system interconnects.
• Package & Mounting — 1932‑BBGA (FCBGA) supplier package listed as 1932‑FBGA, FC (45×45); surface‑mount device for board‑level assembly.
• Power Supply — Core supply range from 870 mV to 930 mV, enabling low‑voltage core operation.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for demanding environments.
• RoHS Compliant — Conforms to RoHS requirements for lead‑free assembly.
• Series Documentation — Stratix V family electrical and switching characteristics, including transceiver and I/O timing guidance, are documented in the Stratix V device datasheet.

Typical Applications

• High‑density programmable logic systems — Use the large logic element count and embedded memory to consolidate complex logic and algorithms on a single device.
• Multi‑interface hub designs — The 840 I/O pins enable integration with numerous peripherals, external memory, and board‑level interfaces.
• Industrial and rugged applications — Industrial temperature rating (−40 °C to 100 °C) supports deployment in temperature‑challenging environments.

Unique Advantages

• High integration density: 622,000 logic elements and ~51.2 Mbits of embedded RAM reduce the need for external logic and memory components.
• Extensive I/O: 840 I/O pins provide flexibility for complex system routing and multiple parallel interfaces.
• Industrial robustness: −40 °C to 100 °C operating range supports designs that must tolerate wide temperature swings.
• Low‑voltage core compatibility: 870 mV–930 mV supply range aligns with modern low‑voltage system architectures.
• Standard surface‑mount package: 1932‑BBGA FCBGA package (1932‑FBGA, FC 45×45) for compact board layouts and high‑density assembly.
• Standards‑oriented documentation: Family datasheet provides electrical and switching characteristics, aiding design integration and validation.

Why Choose 5SGXEA7N2F45I2CV?

The 5SGXEA7N2F45I2CV positions itself for designs that demand substantial programmable logic, large on‑chip memory, and high I/O capacity within an industrial temperature envelope. Its combination of logic density, embedded RAM, and pin count makes it suitable for complex system consolidation where board space and integration matter.

Backed by Stratix V family documentation and industrial‑grade specifications, this device is a fit for engineering teams building high‑density, temperature‑tolerant FPGA solutions that require verified electrical and switching characteristics.

Request a quote or submit a procurement inquiry to obtain pricing and availability information for the 5SGXEA7N2F45I2CV.