5SGXEA7N2F45C3W

The 5SGXEA7N2F45C3W is a Stratix V GX family FPGA from Intel, offered as a commercial-grade, surface-mount FCBGA device. It provides a high density of programmable logic, abundant on-chip memory, and a large I/O complement for complex system integration.

Designed for applications that require substantial logic capacity and extensive interfacing, this device combines 622,000 logic elements with approximately 51.2 Mbits of embedded memory and 840 I/Os. The Stratix V series documentation also describes GX transceiver speed grades available across the family.

Key Features

• Logic Capacity — 622,000 logic elements to implement high-density programmable designs.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for buffering, FIFOs, and block-memory needs.
• I/O Count — 840 I/Os to support wide parallel interfaces and extensive external connectivity.
• Family Transceiver Capabilities — The Stratix V GX family documentation references GX transceiver speed grades (family-level capability information is provided in the device datasheet).
• Package & Mounting — 1932-BBGA FCBGA package (supplier device package: 1932-FBGA, FC 45×45) in a surface-mount form factor for board-level deployment.
• Power Supply — Core voltage supply range from 820 mV to 880 mV for device operation.
• Operating Conditions — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Regulatory — RoHS compliant.

Typical Applications

• High-density signal processing — Use the large logic fabric and substantial embedded memory to implement complex DSP pipelines, large parallel processing engines, and custom accelerators.
• Multiport interfacing and aggregation — High I/O count enables aggregation of multiple high-bandwidth interfaces and wide parallel buses for data-center or communications front-end tasks.
• Custom protocol and peripheral bridging — Implement custom controllers, protocol bridges, and glue logic that require significant logic resources and flexible I/O mapping.

Unique Advantages

• High programmable density: 622,000 logic elements let designs consolidate functionality that might otherwise require multiple components.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependency on external memory for buffering and state storage.
• Extensive I/O availability: 840 I/Os simplify board routing for multi-channel designs and reduce the need for external I/O expanders.
• Compact FCBGA package: The 1932-BBGA FCBGA (45×45) package provides a high pin-count solution in a single surface-mount footprint.
• Commercial temperature rating: Rated for 0 °C to 85 °C to match standard commercial-grade system environments.
• Standards-aligned manufacturing: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5SGXEA7N2F45C3W?

The 5SGXEA7N2F45C3W offers a combination of high logic capacity, significant embedded memory, and a very large I/O complement in a single commercial-grade Stratix V GX FCBGA package. This makes it suitable for designs that need dense programmable logic, extensive on-chip storage, and broad external interfacing while maintaining a compact board footprint.

Engineers targeting complex system integration, high-channel aggregation, and programmable acceleration can leverage this device’s resource set to reduce BOM complexity and centralize functionality into one FPGA. The device is provided with comprehensive Stratix V family documentation to support design integration and verification.

Request a quote or submit a procurement inquiry referencing part number 5SGXEA7N2F45C3W to begin the purchasing process.