5SGXEA7N2F45I2WN

The 5SGXEA7N2F45I2WN is a Stratix V GX Field Programmable Gate Array (FPGA) IC offering high logic capacity and substantial on-chip memory in a high-pin-count BGA package. It targets applications that require dense logic resources, large embedded RAM, and extensive I/O connectivity within industrial temperature ranges.

Key Features

• Core logic capacity — 622,000 logic elements and 234,720 logic array blocks provide substantial programmable fabric for complex digital designs.
• Embedded memory — Approximately 51.2 Mbits of total on-chip RAM for large buffering, lookup tables, and state storage.
• I/O density — 840 user I/Os to support wide parallel interfaces, multi-channel connectivity, and high pin-count system designs.
• Package and mounting — 1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45); surface-mount mounting type for board-level integration.
• Power supply — Core supply range of 870 mV to 930 mV suitable for low-voltage core operation.
• Industrial temperature grade — Rated operating temperature from −40 °C to 100 °C for reliable operation in industrial environments.
• RoHS compliance — Compliant with RoHS environmental standards.

Unique Advantages

• Large programmable fabric: 622,000 logic elements enable implementation of complex FPGA designs without external glue logic.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• High I/O count: 840 I/Os support broad system interfacing and high channel counts directly on-chip.
• Industrial operating range: −40 °C to 100 °C rating supports deployment in industrial temperature environments.
• Compact, high-pin-count package: 1932-BBGA (45×45 FCBGA) provides dense signal routing and accommodates complex board-level layouts.
• Low-voltage core operation: 0.87–0.93 V supply range aligns with modern low-voltage system designs.

Why Choose 5SGXEA7N2F45I2WN?

This Stratix V GX FPGA balances high logic capacity, significant embedded memory, and extensive I/O in a single industrial-grade FCBGA package. It is suited for system designs that require dense programmable resources and large on-chip RAM while operating across a wide industrial temperature range.

The device’s combination of 622,000 logic elements, approximately 51.2 Mbits of RAM, and 840 I/Os provides designers with a scalable platform for complex digital processing tasks, enabling integration and consolidation of system functions with vendor-supported device documentation and specifications.

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