5SGXEA7N2F45I3LN

The 5SGXEA7N2F45I3LN is an Intel Stratix V GX series Field Programmable Gate Array (FPGA) supplied in a 1932-BBGA FCBGA package. It provides a high logic capacity and large on-chip memory combined with a very high I/O count, targeting dense, high-I/O digital designs.

This device is delivered in an industrial temperature grade with a core supply range of 820 mV to 880 mV, supporting designs that require extended temperature operation and high integration of logic, memory, and I/O resources.

Key Features

• High logic capacity — 622,000 logic elements suitable for complex digital designs and large system integration on a single device.
• Embedded memory — Approximately 51.2 Mbits of on-chip RAM to support large buffering, on-chip data storage, and memory-intensive processing.
• Extensive I/O — 840 user I/Os for high-pin-count interfaces, multi-channel connectivity, and large peripheral counts.
• Stratix V GX family — Part of the Stratix V GX device family, with family-level electrical and switching characteristics documented in the Stratix V Device Datasheet.
• Power domain — Core voltage supply range of 820 mV to 880 mV for defined power design and budgeting.
• Package and mounting — 1932-BBGA (FCBGA), supplier device package 1932-FBGA FC (45×45); surface-mount mounting for high-density board implementations.
• Industrial temperature grade — Rated for operation from −40 °C to 100 °C for use in industrial environments.
• RoHS compliant — Meets RoHS environmental requirements.

Typical Applications

• High-density digital systems — Large logic capacity and extensive on-chip memory enable consolidation of multiple functions into a single FPGA for complex digital designs.
• Multi-channel I/O and interfacing — 840 I/Os make the device suitable for applications requiring many parallel interfaces or high port counts.
• Industrial control and automation — Industrial temperature rating and high integration support robust control, sequencing, and data aggregation tasks in industrial systems.
• Communications infrastructure — As a member of the Stratix V GX family, the device aligns with system designs that require high-density logic and significant on-chip memory for data plane processing and buffering.

Unique Advantages

• Large on-chip resource set: 622,000 logic elements and approximately 51.2 Mbits of embedded RAM reduce the need for external logic and memory, simplifying BOM and board space.
• High I/O count: 840 I/Os provide flexibility for complex front-end interfacing, multi-lane data capture, or dense sensor and actuator connectivity.
• Industrial robustness: Rated for −40 °C to 100 °C operation and provided in a reliable FCBGA package for demanding environments.
• Defined power envelope: Core supply specification of 820–880 mV enables predictable power budgeting and thermal planning.
• Standards-aligned family documentation: The Stratix V Device Datasheet describes the family electrical and switching characteristics, supporting detailed system-level design and validation.
• RoHS compliant: Conforms to RoHS requirements to support environmentally conscious product designs.

Why Choose 5SGXEA7N2F45I3LN?

The 5SGXEA7N2F45I3LN delivers a balance of high logic density, substantial on-chip memory, and very large I/O capacity in an industrial-grade Stratix V GX FPGA package. Its defined core voltage range and wide operating temperature window make it appropriate for engineers consolidating complex functions into a single FPGA for industrial, communications, and other high-density applications.

Choosing this device provides a clear path for scalable, high-integration designs where on-chip resources and connectivity reduce external component count and simplify system architecture, while relying on the established Stratix V family documentation for electrical and switching characteristics.

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