5SGXEA7N3F40C3WN

The 5SGXEA7N3F40C3WN is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 1517‑BBGA FCBGA package. It combines high logic capacity, substantial on‑chip memory, and a large I/O count for demanding digital designs.

With 622,000 logic elements and approximately 51.2 Mbits of embedded memory, this commercial‑grade, surface‑mount FPGA targets applications that require dense programmable logic, extensive memory resources, and broad external connectivity. The device is supplied with a core voltage range of 820 mV to 880 mV and rated for operation from 0 °C to 85 °C.

Key Features

• Logic Capacity  622,000 logic elements for large-scale, complex digital designs and high resource utilization.
• Embedded Memory  Approximately 51.2 Mbits of on‑chip RAM to support buffering, look‑up tables, and data‑intensive processing.
• I/O Density  600 I/O pins to enable wide external interfacing and high pin‑count system connectivity.
• Power and Supply  Core supply voltage specified between 820 mV and 880 mV to match system power design requirements.
• Package & Mounting  1517‑BBGA FCBGA package (supplier device package: 1517‑FBGA, 40×40) in a surface‑mount form factor for PCB integration.
• Operating Grade & Temperature  Commercial grade device rated for 0 °C to 85 °C operation.
• Standards Compliance  RoHS compliant.
• Stratix V Family Documentation  Device electrical and switching characteristics, including transceiver and I/O timing information, are covered by the Stratix V device datasheet.

Typical Applications

• High‑speed serial communications  Leverages the Stratix V GX family’s transceiver and I/O capabilities to implement serial link interfaces and board‑level data transport.
• Complex DSP and algorithm acceleration  Large logic capacity and substantial embedded RAM support signal processing, filtering, and algorithmic functions in hardware.
• System integration and prototyping  High I/O count and dense logic enable integration of multiple peripherals and rapid functional prototyping on a single device.

Unique Advantages

• High logic density: 622,000 logic elements allow consolidation of large designs into a single FPGA, reducing board complexity.
• Significant on‑chip memory: Approximately 51.2 Mbits of embedded RAM minimizes external memory dependence for buffering and data‑centric tasks.
• Broad external connectivity: 600 I/O pins accommodate extensive peripheral and interface requirements without multiple devices.
• Industry documentation: Stratix V device datasheet provides detailed electrical and switching characteristics to aid design and validation.
• Compact FCBGA package: 1517‑BBGA / 1517‑FBGA (40×40) packaging supports high‑density PCB layouts in surface‑mount form.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose 5SGXEA7N3F40C3WN?

The 5SGXEA7N3F40C3WN positions itself as a high‑capacity, commercial‑grade Stratix V GX FPGA suited for designs that demand large programmable logic farms, substantial embedded memory, and extensive I/O. Its packaging and power specifications align with compact, high‑density system implementations where integration and on‑chip resources reduce bill‑of‑materials and board complexity.

Engineers and procurement teams seeking a documented Stratix V device with verifiable electrical and switching characteristics will find this part appropriate for advanced communications, DSP, and system prototyping tasks that operate within commercial temperature and supply ranges.

Request a quote or submit an inquiry to start a procurement or design evaluation for the 5SGXEA7N3F40C3WN Stratix® V GX FPGA.