5SGXEA7N3F40C4

The 5SGXEA7N3F40C4 is an Intel Stratix V GX field-programmable gate array supplied in a 1517-BBGA FCBGA package. This commercial-grade FPGA integrates a large logic fabric, substantial on-chip RAM, and a high pin-count I/O interface to support complex digital designs and system integration.

Designed for applications that require significant on-chip resources and flexible I/O, the device combines 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 600 I/Os to enable consolidation of logic, memory, and interfaces into a single programmable device.

Key Features

• Logic Capacity  622,000 logic elements for implementing large digital designs and complex algorithms.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, caches, and on-chip data storage.
• I/O Density  600 user I/Os to accommodate wide parallel interfaces, multiple peripherals, or high-pin-count system interconnects.
• Power Supply  Core voltage range of 820 mV to 880 mV, enabling designs that target the Stratix V core supply window.
• Package & Mounting  1517-BBGA (supplier package: 1517-FBGA, 40×40) in a surface-mount BGA format for high-density board integration.
• Commercial Temperature Grade  Rated for 0°C to 85°C operation for commercial-environment deployments.
• Series-Level Transceiver Options  As documented in the Stratix V GX series datasheet, GX devices in the family offer transceiver speed grades (series-level detail) supporting channel rates up to 14.1 Gbps depending on speed grade selection.
• Regulatory Compliance  RoHS compliant to support environmentally conscious product builds.

Typical Applications

• Data Processing & Acceleration  On-chip logic and memory resources enable implementation of custom data-path accelerators, packet processing, and protocol offload functions.
• High-Density I/O Systems  600 I/Os permit integration of multiple parallel interfaces, bridging functions, and dense sensor or transceiver arrays.
• Communications Infrastructure  Stratix V GX family transceiver options (series-level) and large logic capacity are suitable for line-card functions, fronthaul/backhaul processing, and protocol adaptation.
• Prototyping & System Integration  Combines logic, memory, and I/O in a single device for rapid prototyping and consolidation of multiple discrete components.

Unique Advantages

• Substantial On-Chip Resources:  622,000 logic elements plus approximately 51.2 Mbits of embedded RAM reduce reliance on external logic and memory, simplifying BOM and board routing.
• High I/O Count:  600 I/Os provide flexibility to connect to many peripherals, parallel data buses, or multiple high-speed interfaces without additional I/O expanders.
• Compact, Surface-Mount Package:  1517-BBGA (1517-FBGA, 40×40) delivers a compact footprint for high-density PCBs while supporting the device's pin count and power requirements.
• Commercial Temperature Rating:  Rated 0°C to 85°C to match commercial industrial and enterprise application environments.
• Series Documentation:  Detailed Stratix V device datasheet coverage of electrical and switching characteristics provides design-level reference data for electrical, timing, and power considerations.

Why Choose 5SGXEA7N3F40C4?

The 5SGXEA7N3F40C4 delivers a combination of large logic capacity, substantial embedded memory, and a high I/O count in a compact BGA package—making it well suited for designs that require integration of complex logic, buffering, and extensive interfacing. Its commercial temperature rating and RoHS compliance support a wide range of production applications where these on-chip resources and package density are required.

Engineers and procurement teams seeking to consolidate system functions, reduce external components, and leverage series-level Stratix V documentation for electrical and transceiver characteristics will find this device appropriate for demanding, space-constrained digital designs.

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