5SGXEA7N3F40I3G

The 5SGXEA7N3F40I3G is a Stratix® V GX field programmable gate array (FPGA) providing large on-chip logic and memory capacity in a high-pin-count FCBGA package. Designed for applications that require substantial logic resources and extensive I/O, this industrial-grade device combines 622,000 logic elements with approximately 51.2 Mbits of embedded memory and 600 I/Os to support complex system integration.

Its specification set — including a 1517-BBGA (1517-FBGA 40×40) package, surface-mount mounting, an 820 mV–880 mV core supply range, and an operating temperature range of –40 °C to 100 °C — targets demanding environments and designs that need robust thermal and power operating windows.

Key Features

• Core Logic Density  622,000 logic elements to implement large-scale digital designs and complex custom logic blocks.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for data buffering, packet storage, and large FPGA-based data structures.
• High I/O Count  600 I/Os to support wide parallel interfaces, multi-channel connectivity, and dense board-level integration.
• Industrial Grade Operation  Rated for industrial temperature operation from –40 °C to 100 °C to meet harsh-environment requirements.
• Power Supply  Core voltage supply specified from 820 mV to 880 mV to align with system power planning and regulator selection.
• Package and Mounting  1517-BBGA (supplier package: 1517-FBGA, 40×40) in a surface-mount FCBGA format for high-pin-count board designs.
• Regulatory Status  RoHS compliant.

Typical Applications

• High-density digital systems  Implements large custom logic functions and data-path pipelines where extensive logic and on-chip RAM are required.
• Multi-interface platforms  Supports boards requiring many parallel and serial I/Os thanks to its 600-pin I/O resource.
• Industrial control and automation  Industrial temperature rating and robust package options make it suitable for industrial embedded control systems.
• System integration and prototyping  High logic and memory capacity simplifies consolidation of multiple functions into a single FPGA device for system prototyping and integration.

Unique Advantages

• Large integrated logic and memory: 622,000 logic elements combined with ~51.2 Mbits of embedded memory reduce the need for external FPGA support components.
• Extensive I/O resources: 600 I/Os enable dense board-level connectivity and flexible interface mapping for complex systems.
• Industrial temperature capability: Operation from –40 °C to 100 °C supports deployments in a wide range of ambient conditions.
• Compact high-pin-count package: 1517-BBGA (1517-FBGA, 40×40) FCBGA provides a high I/O density in a surface-mount form factor for space-efficient designs.
• Controlled core power envelope: Specified 820 mV–880 mV supply range helps with predictable power budgeting and regulator selection.
• RoHS compliant: Meets environmental compliance requirements for lead-free manufacturing processes.

Why Choose 5SGXEA7N3F40I3G?

The 5SGXEA7N3F40I3G positions itself where large on-chip logic capacity, substantial embedded memory, and very high I/O count are required in an industrial-temperature FPGA. Its combination of 622,000 logic elements, approximately 51.2 Mbits of RAM, and 600 I/Os in a 1517-BBGA FCBGA package supports integration of complex subsystems onto a single device while offering clear power and thermal operating parameters.

This device is well suited to engineers and procurement teams designing high-density digital platforms, industrial embedded systems, and multi-interface boards that need a scalable, RoHS-compliant FPGA solution from the Stratix V GX family.

Request a quote or submit an inquiry to receive pricing and availability for the 5SGXEA7N3F40I3G. Technical datasheet and specification support are available upon request to assist with design integration and system selection.