5SGXEA7N3F40I3LN

The 5SGXEA7N3F40I3LN is an Intel Stratix® V GX Field Programmable Gate Array (FPGA) IC optimized for high-density, industrial-grade digital designs. It delivers a large logic fabric and embedded memory together with a broad I/O count in a 1517‑ball FCBGA package.

As a member of the Stratix V GX family, this device is specified for industrial temperature operation and supports the family’s transceiver-capable architecture described in the Stratix V device documentation.

Key Features

• High-density logic — 622,000 logic elements to implement complex digital functions and large-scale integration.
• Logic array blocks — 234,720 logic array blocks for scalable logic partitioning and routing.
• Embedded memory — Approximately 51.2 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive algorithms without external SRAM.
• Generous I/O — 600 user I/O pins to support broad peripheral connectivity and parallel interfaces.
• Power and core supply — Core voltage supply range of 820 mV to 880 mV for the device core.
• Industrial temperature range — Rated for operation from −40 °C to 100 °C for deployment in harsh environments.
• Package and mounting — 1517‑BBGA (FCBGA) package, supplier package listed as 1517‑FBGA (40×40), designed for surface-mount assembly.
• RoHS compliant — Conforms to RoHS requirements for lead-free designs.

Typical Applications

• High-density logic integration — Implement large, consolidated logic designs using the device’s 622,000 logic elements and extensive LAB resources.
• Memory-intensive processing — Leverage approximately 51.2 Mbits of embedded RAM for buffering, data aggregation, and packet processing tasks.
• Multi-interface systems — Use the 600 I/O pins for connecting multiple parallel buses, control interfaces, and peripheral subsystems.
• Industrial and rugged electronics — Deploy in systems requiring wide operating temperature capability (−40 °C to 100 °C) and surface-mount FCBGA packaging.

Unique Advantages

• High logic capacity: 622,000 logic elements reduce the need for multiple devices, simplifying board design and lowering system BOM.
• Large on-chip RAM: Approximately 51.2 Mbits of embedded memory enables substantial on-chip buffering and state storage without external memory.
• Extensive I/O connectivity: 600 I/O pins allow integration of multiple peripherals and interfaces directly to the FPGA fabric.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C supports deployment in demanding environments.
• Low-voltage core operation: Core supply range of 820–880 mV aligns with modern power-optimized FPGA implementations.
• Compact, surface-mount package: 1517‑BBGA (FCBGA) 40×40 supplier package provides a high-pin-count footprint for dense system designs.

Why Choose 5SGXEA7N3F40I3LN?

The 5SGXEA7N3F40I3LN positions itself as a high-density, industrial-grade FPGA option within the Stratix V GX family, combining substantial logic capacity, significant on-chip RAM, and a large I/O complement in a compact FCBGA package. Its specified core voltage range and wide operating temperature window make it suitable for demanding digital systems that prioritize integration and robustness.

This device is well suited for engineers and system designers who need to consolidate complex logic, handle memory-heavy workloads on-chip, and interface to many peripherals while maintaining industrial temperature performance and RoHS compliance.

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