5SGXEA7N3F40I4

The 5SGXEA7N3F40I4 is a Stratix® V GX field programmable gate array (FPGA) in a 1517-ball FCBGA package. It provides large on-chip logic and memory resources along with a high I/O count, targeting designs that require extensive logic capacity and significant I/O integration.

Key hardware characteristics include 622,000 logic elements, approximately 51.2 Mbits of embedded memory, 600 I/Os, and an industrial operating temperature range, making the device suitable for complex, high-density digital designs that must operate across a wide temperature span.

Key Features

• Core Logic Capacity — 622,000 logic elements (cells) to implement large-scale programmable logic functions.
• Logic Blocks — 234,720 logic blocks available for structured logic partitioning and resource mapping.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for buffering, FIFOs, and data storage.
• I/O Resources — 600 I/O pins to support dense board-level connectivity and multiple interfaces.
• Power Supply Range — Core voltage supply specified from 820 mV to 880 mV, enabling defined low-voltage core operation.
• Package and Mounting — 1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40), designed for surface-mount assembly.
• Operational Temperature — Industrial-grade operation from −40 °C to 100 °C for temperature-sensitive deployments.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• High-density digital processing — Use the 622,000 logic elements and large embedded RAM to implement complex state machines, datapaths, and parallel processing blocks.
• I/O consolidation — With 600 I/Os, consolidate multiple interfaces and peripherals on a single FPGA to reduce board-level component count.
• Industrial systems — The −40 °C to 100 °C operating range supports deployments in demanding industrial environments.

Unique Advantages

• Extensive programmable resources: 622,000 logic elements and 234,720 logic blocks provide the capacity needed for large logic designs.
• Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM enables local buffering and high-throughput data handling without external memory for many use cases.
• High I/O density: 600 I/Os allow flexible and dense peripheral and bus connectivity on a single device.
• Industrial operating range: Rated from −40 °C to 100 °C to meet temperature requirements for industrial deployments.
• Compact high-pin-count package: 1517-ball FCBGA (1517-FBGA 40×40) supports high-density PCB layouts and surface-mount assembly.
• Defined core voltage range: 820 mV–880 mV power requirement provides clear guidance for power-supply design.

Why Choose 5SGXEA7N3F40I4?

The 5SGXEA7N3F40I4 delivers a combination of large logic capacity, substantial embedded memory, and a high I/O count packaged in a surface-mount FCBGA suitable for compact, high-density boards. Its industrial temperature rating and RoHS compliance make it appropriate for projects that require robustness across a wide thermal range.

This device is well suited to engineers and system designers implementing complex digital systems that demand significant on-chip resources and extensive external connectivity while maintaining a defined core-voltage and packaging footprint.

Request a quote or submit an inquiry today to receive pricing and availability for the 5SGXEA7N3F40I4 Stratix® V GX FPGA.