5SGXEA7N3F45C2G

The 5SGXEA7N3F45C2G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel. It delivers high logic density and on-chip memory with 622,000 logic elements and approximately 51.2 Mbits of embedded RAM, and supports up to 840 I/Os in a 1932-BBGA FCBGA package.

Device-level specifications include a commercial operating temperature range of 0 °C to 85 °C and a core supply range of 870 mV to 930 mV. The Stratix V series datasheet documents transceiver and I/O timing features at the series level, which inform system integration and interface design choices.

Key Features

• Core Logic 
  622,000 logic elements providing a high-density programmable fabric for complex digital designs.
• Logic Array Blocks (LABs) 
  234,720 LABs (logic array blocks) for organized logic grouping and resource partitioning.
• On‑Chip Memory 
  Approximately 51.2 Mbits of total embedded RAM for buffering, packet storage, and state retention within the FPGA.
• I/O Density 
  Up to 840 I/Os to support wide parallel interfaces and high-pin-count system connectivity.
• Package 
  1932-BBGA (FCBGA), supplier device package listed as 1932-FBGA, FC (45×45) for high pin-count surface-mount deployment.
• Power 
  Core voltage supply range of 870 mV to 930 mV to align power budgeting and regulator selection.
• Operating Range 
  Commercial grade operation from 0 °C to 85 °C for mainstream electronics applications.
• Assembly 
  Surface mount mounting type suitable for modern PCB assembly processes.
• Compliance 
  RoHS compliant for regulatory alignment in lead-free manufacturing environments.

Typical Applications

• High-density digital processing 
  Programmable logic implementations that require a large number of logic elements and embedded RAM for algorithms and data flow control.
• High‑pin-count interface aggregation 
  Systems that need extensive parallel or multi-channel connectivity using the device’s 840 I/Os and high pin-count package.
• Custom hardware acceleration 
  Designs that offload compute-intensive tasks into FPGA fabric using available logic and memory resources.
• System prototyping and integration 
  Platform-level development where a commercial-grade FPGA with broad resources accelerates design validation and integration.

Unique Advantages

• High integration density: The combination of 622,000 logic elements and approximately 51.2 Mbits of embedded RAM reduces external component count and simplifies board-level architecture.
• Extensive I/O capability: 840 I/Os and a 1932-BBGA package enable high-channel count designs and straightforward routing for complex systems.
• Organized logic resources: 234,720 LABs provide structured resource allocation for partitioned or multi-function designs.
• Commercial operating range: Rated for 0 °C to 85 °C to match standard commercial electronics environments and deployments.
• Regulatory readiness: RoHS compliance supports lead-free manufacturing and product acceptance in many global markets.
• Surface-mount package: FCBGA surface-mount assembly aligns with common PCB manufacturing workflows for high-density devices.

Why Choose 5SGXEA7N3F45C2G?

The 5SGXEA7N3F45C2G positions itself as a high-density Stratix V GX FPGA option for designs that require substantial logic capacity, on-chip memory, and a very high I/O count in a single, surface-mount FCBGA package. Its commercial temperature rating and defined core voltage range make the device straightforward to integrate into mainstream electronic systems.

Choose this device when your design demands a large programmable fabric with significant embedded memory and high pin-count connectivity, while maintaining compliance with RoHS and standard commercial operating conditions. The series-level Stratix V documentation further supports integration by providing transceiver and I/O timing guidance for system architects.

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