5SGXEA7N3F45C2LG

The 5SGXEA7N3F45C2LG is a Stratix® V GX field programmable gate array (FPGA) optimized for high‑density, high‑I/O system designs. It integrates a large fabric of programmable logic with abundant on‑chip memory and extensive I/O to support complex digital signal processing, protocol bridging, and high‑speed communication applications.

Targeted at commercial temperature applications, this device delivers a combination of high logic capacity, approximately 51 Mbits of embedded memory, and up to 840 user I/Os in a 1932‑ball FCBGA package—enabling compact, high‑performance implementations where board area and I/O count are critical.

Key Features

• Logic Capacity — 622,000 logic elements provide large-scale programmable resources for complex state machines, DSP pipelines, and custom accelerators.
• Embedded Memory — Approximately 51 Mbits of on‑chip RAM to support large buffering, lookup tables, and memory‑intensive algorithms.
• High I/O Count — 840 user I/Os to simplify board routing and enable dense peripheral and high‑speed interface connectivity.
• Transceiver Capability (Series) — Stratix V GX devices in the series support transceiver channel speed grades up to 14.1 Gbps, enabling high‑speed serial links where required by the application.
• Power and Core Voltage — Core supply range of 820 mV to 880 mV to match platform power architectures and enable predictable power budgeting.
• Package & Mounting — 1932‑BBGA (FCBGA) package; supplier device package listed as 1932‑FBGA, FC (45×45 mm). Surface‑mount device for standard PCB assembly.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature for commercial applications.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• High‑performance networking — Implement multi‑lane, high‑speed packet processing and protocol offload engines using the device’s large logic fabric and GX transceiver capabilities.
• Video and image processing — Use abundant logic and embedded RAM for real‑time video pipelines, frame buffering, and scalable DSP implementations.
• Compute acceleration — Deploy custom hardware accelerators and dataflow engines that require many logic elements and on‑chip memory for low‑latency throughput.
• Test and measurement — Build flexible, I/O‑intensive instrumentation and data acquisition systems leveraging the high I/O count and dense package.

Unique Advantages

• High logical density: 622,000 logic elements enable consolidation of multiple functions on a single device, reducing system BOM and inter‑device latency.
• Substantial on‑chip memory: Approximately 51 Mbits of embedded RAM supports large buffers and complex state storage without external memory dependence.
• Extensive I/O capability: 840 user I/Os simplify board design for systems requiring many parallel interfaces or high pin‑count peripherals.
• Compact, high‑ball‑count package: 1932‑BBGA (45×45 mm) offers dense routing in a surface‑mount form factor suitable for space‑constrained PCBs.
• Commercial temperature suitability: Rated 0 °C to 85 °C for mainstream commercial deployments and development environments.
• Standards‑conscious manufacturing: RoHS compliance supports modern environmental and assembly requirements.

Why Choose 5SGXEA7N3F45C2LG?

The 5SGXEA7N3F45C2LG combines a very large logic resource with extensive embedded memory and a high I/O count in a compact FCBGA package, making it a practical choice for designers building complex, I/O‑dense systems. Its commercial temperature rating and defined core voltage range facilitate predictable integration into power and thermal designs.

This device is well suited for customers developing advanced networking, video processing, or compute‑acceleration designs who need scalable programmable logic, significant on‑chip RAM, and the option to leverage high‑speed serial transceivers available across the Stratix V GX series.

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