5SGXEA7N3F45C2WN

The 5SGXEA7N3F45C2WN is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, offered in a 1932-BBGA FCBGA package for surface-mount applications. It provides a very high logic capacity and dense I/O suitable for designs that require extensive on-chip logic and memory.

With 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 840 I/O pins, this commercial-grade device targets high-density digital processing and I/O‑intensive applications where integration and board-level I/O count are primary considerations.

Key Features

• Core Logic  622,000 logic elements (cells) to implement complex digital functions and large combinational/sequential logic networks.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, packet storage, and local data processing.
• I/O Density  840 I/O pins to support wide parallel buses, multiple interfaces, and high pin-count system connectivity.
• Package & Mounting  1932-BBGA (FCBGA) package, supplier package listed as 1932-FBGA, FC (45×45), designed for surface-mount assembly.
• Power  Specified core voltage supply range from 870 mV to 930 mV for the device core.
• Temperature Grade  Commercial operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant for environmental and regulatory conformity.

Typical Applications

• High-density digital processing  Leverage the 622,000 logic elements and large embedded memory to implement complex datapaths, custom accelerators, and processing pipelines.
• I/O‑intensive systems  Use the 840 available I/O pins for wide parallel interfaces, multi-channel sensor arrays, or protocol bridging in board-level designs.
• Data buffering and packet handling  Approximately 51.2 Mbits of on-chip RAM supports buffering, packet staging, and local storage for throughput-sensitive applications.

Unique Advantages

• Massive logic capacity: 622,000 logic elements enable large-scale designs without immediate partitioning across multiple devices.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and temporary storage needs.
• Extensive I/O availability: 840 I/O pins provide flexibility for complex interfacing and high channel counts on a single FPGA.
• Compact, assembly-ready package: 1932-BBGA (45×45) FCBGA packaging suits high-density PCB layouts and surface-mount production flows.
• Commercial temperature support: Rated for 0 °C to 85 °C operation for standard commercial applications and environments.
• Regulatory compliance: RoHS compliant to support environmentally regulated product builds.

Why Choose 5SGXEA7N3F45C2WN?

The 5SGXEA7N3F45C2WN combines large logic capacity, significant on-chip memory, and a very high I/O count in a single Stratix V GX FPGA package, making it suitable for designs that demand dense, integrated programmable logic and extensive board-level connectivity. Its defined core voltage range and commercial temperature rating provide clear electrical and thermal parameters for system design.

Manufactured by Intel as part of the Stratix V family, this device is supported by the Stratix V device documentation and is appropriate for teams designing advanced digital systems that require scalable logic resources, sizable embedded memory, and high pin counts in a compact surface-mount package.

Request a quote or submit an inquiry to receive pricing and availability for 5SGXEA7N3F45C2WN and to discuss how this Stratix V GX FPGA can meet your design requirements.