5SGXEA7N3F45C4

The 5SGXEA7N3F45C4 is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1932-BBGA FCBGA package. This commercial-grade device provides a high logic element count and a large on-chip memory footprint for designs that require dense programmable logic and substantial embedded RAM.

Key attributes visible from the device data include 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 840 I/O pins. The device is supplied for surface-mount assembly and operates over a core supply range of 820 mV to 880 mV with a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic Capacity — 622,000 logic elements, enabling complex logic implementation and large-scale digital designs.
• Embedded Memory — Approximately 51.2 Mbits of total on-chip RAM for buffering, lookup tables, and state storage.
• I/O Density — 840 available I/Os to support wide parallel interfaces and mixed-signal board routing requirements.
• Package — 1932-BBGA (FCBGA) supplier device package listed as 1932-FBGA, FC (45×45) for compact high-density system integration.
• Power and Supply — Core voltage supply range specified at 820 mV to 880 mV for defined power domains.
• Temperature and Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Mounting — Surface mount package suitable for automated PCB assembly.
• Compliance — RoHS compliant.

Typical Applications

• High-density digital processing — Use where large logic capacity and embedded memory are required for complex algorithms and datapath implementations.
• Network and communications equipment — High I/O count supports parallel interfaces and board-level connectivity in communication systems.
• System prototyping and integration — Large logic and memory resources are suitable for prototyping multi-function SoC architectures and system consolidation.

Unique Advantages

• Large programmable fabric — 622,000 logic elements provide headroom for scaling complex designs without immediate migration to multiple devices.
• Substantial on-chip RAM — Approximately 51.2 Mbits of embedded memory reduces the need for external memory in many buffering and state-storage use cases.
• Extensive I/O — 840 I/Os enable flexible external interfacing and high-bandwidth parallel connections.
• Commercial temperature rating — Specified 0 °C to 85 °C operation for standard commercial deployments.
• Compact, high-density package — 1932-BBGA (45×45) package supports dense PCB layouts while maintaining high pin count.
• Regulatory alignment — RoHS compliance supports environmentally restricted manufacturing requirements.

Why Choose 5SGXEA7N3F45C4?

The 5SGXEA7N3F45C4 combines high logic capacity, significant embedded memory, and a large I/O complement in a single commercial-grade FCBGA package. It is positioned for designs that need to consolidate complex digital functions and substantial buffering on a single FPGA footprint while maintaining tight board-level integration.

As an Intel Stratix V GX family device, detailed electrical and switching characteristics are documented in the device datasheet to support design validation and integration. The device’s package, supply, and temperature specifications make it suitable for high-density commercial applications requiring predictable supply domains and defined operating limits.

Request a quote or submit an inquiry to obtain pricing, lead time, and availability for the 5SGXEA7N3F45C4. Our team can provide technical and procurement information to help integrate this Stratix V GX FPGA into your next design.