5SGXEA7N3F45C3

The 5SGXEA7N3F45C3 is a Stratix® V GX field programmable gate array (FPGA) designed for commercial-grade applications requiring high logic density and substantial embedded memory. This device integrates a large number of logic elements and on-chip RAM while providing a high I/O count in a 1932-ball FCBGA package.

With a defined core voltage range and a commercial operating-temperature window, the part is targeted at system designs that demand dense programmable logic, extensive buffering, and wide external connectivity within a surface-mount package footprint.

Key Features

• High Logic Capacity — 622,000 logic elements (cells) to support complex, high-density designs and large-scale custom logic implementations.
• Substantial Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for packet buffering, frame storage, and large local datasets.
• Extensive I/O — 840 user I/Os to enable broad external interfacing, parallel buses, and multi-channel connectivity.
• Package and Board Mounting — 1932-BBGA, FCBGA (supplier package: 1932-FBGA, FC 45×45) in a surface-mount form factor for dense PCB integration.
• Power Supply — Core voltage supply specified between 820 mV and 880 mV to match system power-rail requirements.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for commercial-environment deployments.
• Standards Compliance — RoHS compliant.

Typical Applications

• High-density custom logic — Implement large, application-specific functions that require up to 622,000 logic elements and abundant on-chip RAM.
• Memory-intensive buffering and data staging — Use the approximately 51.2 Mbits of embedded RAM for streaming, buffering, and packet/frame storage.
• High-connectivity systems — Support board-level bridging, parallel interfaces, and multi-channel I/O with up to 840 user I/Os.

Unique Advantages

• Large programmable fabric: 622,000 logic elements enable complex algorithms and sizable RTL implementations without immediate partitioning concerns.
• On-chip memory capacity: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and caching tasks.
• Flexible I/O density: 840 I/Os provide wide connectivity options for parallel interfaces and multi-channel designs.
• Compact FCBGA package: 1932-ball FCBGA (45×45) allows high-density integration in space-constrained PCBs while maintaining surface-mount assembly compatibility.
• Commercial-grade availability: Specified for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.
• Defined core supply window: 0.820–0.880 V supply requirement gives clear power-rail targets for system power design.

Why Choose 5SGXEA7N3F45C3?

The 5SGXEA7N3F45C3 delivers a balance of high logic capacity, substantial embedded RAM, and a large I/O count within a 1932-ball FCBGA package for commercial designs. It is well suited to teams needing a programmable platform that consolidates complex logic and on-chip storage while providing broad external connectivity.

Spec-driven selection of this Stratix V GX device helps designers scale functionality without immediately expanding board-level memory or I/O components, and the part’s RoHS compliance and defined operating limits support predictable integration into commercial systems.

Request a quote or submit an inquiry to obtain pricing, availability, and ordering information for 5SGXEA7N3F45C3.