5SGXEA7N3F45C2N

The 5SGXEA7N3F45C2N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel. It provides a high-density programmable fabric with 622,000 logic elements and approximately 51.2 Mbits of embedded memory for complex digital designs.

With 840 I/O, a compact 1932-BBGA FCBGA package, commercial temperature grading, and a low-voltage core supply range, this device is targeted at designs that require large logic capacity, substantial on-chip memory, and extensive external interfacing within standard commercial temperature environments.

Key Features

• Core Logic  622,000 logic elements (logic cells) to implement large-scale programmable logic and custom datapaths.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, lookup tables, and memory-intensive logic functions.
• I/O Capacity  840 I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Power and Supply  Core voltage supply specified from 870 mV to 930 mV to match low-voltage FPGA power domains.
• Package & Mounting  1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount mounting type.
• Temperature & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for restricted substance adherence.

Typical Applications

• High-density digital processing  Large programmable logic capacity and embedded memory make this device suitable for complex datapath and control logic implementations.
• Multi-channel I/O systems  High I/O count supports designs requiring extensive parallel interfaces or many peripheral connections.
• Memory-intensive functions  Approximately 51.2 Mbits of embedded RAM enables buffering, packet handling, and other on-chip memory uses.

Unique Advantages

• Large logic fabric: 622,000 logic elements provide the capacity to implement large or multiple concurrent functions on a single device.
• Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces dependency on external memory for many designs.
• Extensive external interfacing: 840 I/O pins facilitate wide parallel connections and flexible board-level integration.
• Compact, surface-mount BGA package: 1932-BBGA (45×45) package balances high pin count with a standard surface-mount footprint.
• Commercial temperature suitability: Rated for 0 °C to 85 °C, matching typical commercial electronic product environments.
• RoHS compliant: Meets restricted substance requirements for mainstream electronic assemblies.

Why Choose 5SGXEA7N3F45C2N?

This Stratix V GX device combines high logic density, significant on-chip memory, and a large I/O count in a single commercial-grade FPGA package. It is well-suited for engineering teams building complex digital systems that require substantial programmable resources and broad interfacing capability within standard commercial temperature ranges.

Backed by Intel’s Stratix V device family documentation, the 5SGXEA7N3F45C2N provides a verifiable specification set for procurement and system integration where on-chip memory, logic capacity, and I/O density are primary selection criteria.

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