5SGXEA7N3F45C2LN

The 5SGXEA7N3F45C2LN is a Stratix V GX family FPGA IC delivering very high logic density and on-chip memory in a single surface-mount FCBGA package. It combines large embedded memory and extensive I/O to support dense, high-throughput designs.

Designed for commercial-grade applications, this device is suited to high-density digital logic and multi-gigabit serial designs where large programmable logic capacity, abundant I/O, and precise supply control are required.

Key Features

• Programmable Logic Capacity — Approximately 622,000 logic elements to implement large, complex logic functions and system-on-chip style designs.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM to support buffering, packet processing, and large state machines without external memory.
• I/O Density — 840 programmable I/O pins, providing broad connectivity for parallel interfaces, SerDes endpoints, and board-level routing flexibility.
• Transceiver Capability (Series) — The Stratix V GX series documentation describes multi-gigabit transceiver support (series-level capability up to 14.1 Gbps), enabling high-speed serial links where required.
• Power Supply Range — Core voltage supply operating window from 820 mV to 880 mV to match regulated core power rails and enable predictable power budgeting.
• Package & Mounting — 1932-ball BGA, FCBGA package (supplier package: 1932-FBGA, FC, 45×45 mm) optimized for high-density board integration; surface-mount mounting type.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for commercial applications.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• High-density digital processing — Implement large combinatorial and sequential designs, hardware accelerators, and custom compute blocks using the device’s extensive logic element count and embedded memory.
• High-speed serial communications — Leverage Stratix V GX series transceiver capabilities for multi-gigabit links and backbone connectivity in communication subsystems.
• Network and packet processing — Use abundant embedded RAM and I/O to implement buffering, packet parsing, and protocol handling within a single FPGA device.

Unique Advantages

• High integration density: Large logic-element count and substantial on-chip RAM reduce dependence on external logic and memory, simplifying PCB design and BOM.
• Broad I/O support: 840 I/O pins provide the routing headroom to connect multiple interfaces and accelerate system-level integration.
• Industry-proven series capabilities: Stratix V GX series documentation includes multi-gigabit transceiver support, enabling high-throughput serial interfaces when needed.
• Compact, surface-mount BGA: 1932-ball FCBGA package delivers high pin count in a 45 × 45 mm footprint for dense board implementations.
• Commercial-grade operating range: Rated for 0 °C to 85 °C to match a wide range of commercial system environments.
• RoHS compliant: Meets lead-free and hazardous-substance restrictions for modern production requirements.

Why Choose 5SGXEA7N3F45C2LN?

The 5SGXEA7N3F45C2LN combines very large programmable logic capacity, substantial embedded memory, and high I/O count in a single commercial-grade Stratix V GX FCBGA package. It is positioned for complex, high-density designs that require significant on-chip resources and support for high-speed serial connectivity at the series level.

This device is appropriate for teams building advanced communications, packet-processing, or compute-accelerator hardware who need a highly integrated FPGA platform with predictable power and temperature characteristics and broad ecosystem documentation from the Stratix V GX family.

If you would like pricing, availability, or a formal quote for the 5SGXEA7N3F45C2LN, please submit a request or sales inquiry referencing the part number and your planned quantity. Our sales team will provide up-to-date lead times and configuration support.