5SGXEA7N3F45C3G

The 5SGXEA7N3F45C3G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC in a 1932-BBGA (FCBGA) package. It delivers very high logic density and large embedded memory for demanding programmable-logic applications that require extensive I/O and on-chip resources.

With hundreds of thousands of logic elements, tens of megabits of embedded RAM, and support for high-speed transceiver speed grades across the Stratix V GX family, this device addresses high-density digital designs where integration, I/O count, and memory capacity are key requirements.

Key Features

• Core logic — 622,000 logic elements and 234,720 logic units for large-scale combinational and sequential logic implementation.
• Embedded memory — Total on-chip memory of 51,200,000 bits (approximately 51.2 Mbits) to support large buffering, FIFOs, and local data storage.
• I/O capacity — 840 user I/Os to support dense peripheral interfacing and wide parallel buses.
• Transceiver speed grades (Stratix V GX series) — Series documentation lists GX channel transceiver speed grades that include up to 14.1 Gbps, providing high-speed serial capability within the Stratix V GX family.
• Power and supply — Core voltage supply range of 820 mV to 880 mV for regulated core-power planning.
• Package and mounting — 1932-BBGA, FCBGA package; supplier device package listed as 1932-FBGA, FC (45 × 45); surface-mount mounting type for standard PCB assembly.
• Temperature and grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Regulatory — RoHS compliant.

Typical Applications

• High-speed serial communications — Leverage the Stratix V GX family transceiver speed grades for designs that require high-bandwidth serial links.
• Compute and acceleration — Large logic and embedded memory resources make this device suitable for acceleration blocks and compute-intensive custom logic.
• System I/O aggregation — High I/O count supports dense peripheral connectivity, wide data buses, and complex interface bridging.

Unique Advantages

• High logic density: 622,000 logic elements enable complex, large-scale designs without external glue logic.
• Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces dependence on external memory for buffering and local storage.
• Extensive I/O: 840 I/Os allow broad interfacing options and support for parallel data paths.
• Commercial-grade temperature range: Rated for 0 °C to 85 °C to match standard commercial deployment environments.
• RoHS compliant: Meets common environmental and manufacturing process requirements.
• Surface-mount FCBGA packaging: High-pin-count 1932-BBGA package supports compact PCB implementations with high routing density.

Why Choose 5SGXEA7N3F45C3G?

This Stratix V GX FPGA combines very large logic capacity, significant embedded RAM, and a high I/O count in a compact 1932-BBGA package, making it well suited for designers targeting high-density programmable logic implementations. The device’s core voltage range, commercial temperature rating, and RoHS compliance support predictable integration into mainstream electronic systems.

Choose this part for designs that require integrated memory, extensive I/O, and the ability to utilize the Stratix V GX family’s transceiver capabilities. The part is positioned for customers who need scalable logic resources with on-chip RAM and wide interfacing in a surface-mount BGA package.

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